Texas Instruments Corporation

David B Blair

Rafael C Alfaro

Leon Stiborek

The present invention provides, in one embodiment, a semiconductor wafer () dicing process. The dicing process comprises removing circuit features () from a street () located between dies () on a semiconductor substrate () using a first blade (), such that the semiconductor substrate is exposed, and cutting through the exposed semiconductor substrate using a second blade (). The first blade has a surface () coated with an abrasive material () comprising grit particles (), having a median diameter () of at least about 25 microns. The grit particles are adhered to the first blade with a bonding agent () having a hardness of about 80 or less (Rockwell B Hardness scale). The grit particles have a concentration in the bonding agent ranging from about 25 to about 50 vol %. Another embodiment of the invention is a method of manufacturing a semiconductor device ().

Method for dicing and singulating substrates

A dicing saw blade assembly with parallel blades separated by a spacer and attached to a single spindle on an automated dicing saw, is applicable to precisely separating CSP or MCM devices which have been fabricated on a polymeric substrate. Two parallel cuts are made simultaneously in the scribe streets of the substrate to separate the flip chip devices. The substrates are diced from the bottom side, thereby allowing use of thin blades for separating devices having relatively thick chips, as well as chips with attached heat spreaders.

Dual dicing saw blade assembly and process for separating devices arrayed a substrate

Active sites (18) on a semiconductor wafer (14) are protected from particulate and fluid contaminants (40,42)while the wafer (14) is sawed into chips (16) by a tape (62) carrying a pattern of adhesive (64) which is congruent and registerable with saw paths (15) between the active sites (18). Adhering the tape (62) to the wafer (14) encapsulates each active site (18) beneath a non-adherent protective envelope which if formed by adhesive-free portions (68) of the tape (62) as sawing occurs along the saw paths (15) and the congruent adhesive pattern (64). After sawing, the adhesive (64) is treated, as by directing UV through the tape (62), to release the tape (62) from the chips (16).

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Blue Ridge, TX, United States of America

David B Blair