Rockley Photonics Limited

Cirrus Logic Inc.

Jds Uniphase Corporation

David Arlo Nelson

Karlheinz Muth

Brett Sawyer

SeungJae Lee

Vivek Raghunathan

Chia-Te Chou

Vivek Raghuraman

Aaron John Zilkie

Pradeep Srinivasan

Amit Singh Nagra

Thomas Pierre Schrans

Jeffrey B Driscoll

Gerald Cois Byrd

Dong Yoon Oh

Aaron L Birkbeck

Javid Messian

Guomin Yu

David Erich Tetzlaff

Hooman Abediasl

Haydn Frederick Jones

Damiana Lerose

Cyriel Johan Agnes Minkenberg

Steve Akwaa Aboagye

Rajagopal Krishnaswamy

A semiconductor package. In some embodiments, the package has a top surface and a bottom surface, and includes: a semiconductor die having a front surface, a back surface, and a plurality of edges; a mold compound, on the back surface of the die and the edges of the die; a plurality of first conductive elements extending through the mold compound on the back surface of the die to the top surface of the package; and a plurality of second conductive elements on the bottom surface of the package.

Packaging of three-dimensional integrated circuit by encapsulation with copper posts and double sided redistribution layer

An enhanced bandwidth interconnect circuit. In some embodiments the circuit includes a two-terminal device and a network for forming a connection to the two-terminal device. The network may include a first set of coupled transmission lines and a second set of coupled transmission lines. A second end of the first set of coupled transmission lines may be connected to a first end of the second set of coupled transmission lines, and a second end of the second set of coupled transmission lines may be connected to the two-terminal device.

Enhanced bandwidth interconnect

An optical engine. In some embodiments, the optical engine includes an electronic interfacing component including: an upper surface having a plurality of conductors for forming a corresponding plurality of connections to a host board, a lower surface having a plurality of conductors for forming a corresponding plurality of connections to one or more optoelectronic elements, and a plurality of vias extending from the lower surface to the upper surface.

Optical engine

A system including an optical engine. In some embodiments, the system includes an integrated circuit in a first-level package, and the system includes the optical engine, in the first-level package, and the optical engine includes an electro-optical chip.

A Mach-Zehnder waveguide modulator. In some embodiments, the Mach-Zehnder waveguide modulator includes a first arm including a first optical waveguide, and a second arm including a second optical waveguide. The first optical waveguide includes a junction, and the Mach-Zehnder waveguide modulator further includes a plurality of electrodes for providing a bias across the junction to enable control of the phase of light travelling through the junction.

Waveguide modulator structures

A faceplate pluggable remote laser source and system incorporating such a laser source. The system may include an enclosure having a faceplate; a first optical connector, in the faceplate; a laser module; and a loopback fiber cable, connected between the laser module and the first optical connector. The faceplate may form an exterior boundary of the enclosure. The laser module may have a first end including an electrical interface, and a second end including an optical interface. The first end of the laser module may be engaged in a receptacle in the faceplate, and the second end of the laser module may extend outside the faceplate. The laser module may be configured to receive electrical power through the electrical interface, and to produce unmodulated light at the optical interface. The loopback fiber cable and the first optical connector may be configured to route the unmodulated light back into the enclosure.

Faceplate pluggable remote laser source and system incorporating same

An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.

Electro-optical package and method of fabrication

A modulator. In some embodiments, the modulator includes a portion of an optical waveguide, the waveguide including a rib extending upwards from a surrounding slab. The rib may have a first sidewall, and a second sidewall parallel to the first sidewall. The rib may include a first region of a first conductivity type, and a second region of a second conductivity type different from the first conductivity type. The second region may have a first portion parallel to and extending to the first sidewall, and a second portion parallel to the second sidewall. The first region may extend between the first portion of the second region and the second portion of the second region.

PN-junction phase modulator in a large silicon waveguide platform

An assembly. In some embodiments, the assembly includes: a photonic integrated circuit; and an electronic integrated circuit. A front surface of the photonic integrated circuit abuts, in an area of overlap, against a front surface of the electronic integrated circuit. A first portion of the photonic integrated circuit overhangs a first edge of the electronic integrated circuit, and a first portion of the electronic integrated circuit overhangs a first edge of the photonic integrated circuit. A conductor on the front surface of the electronic integrated circuit is connected, in the area of overlap, to a conductor on the front surface of the photonic integrated circuit.

Co-packaged optics and transceiver

A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.

Copackaging of asic and silicon photonics

A modulator drive circuit, including: a first transistor having: a first output terminal connected to a first reference voltage, a second output terminal connected to a first output terminal of the modulator drive circuit, and a control terminal; and a second transistor having: a first output terminal connected to a second reference voltage different from the first reference voltage, a second output terminal connected to the first output terminal of the modulator drive circuit, and a control terminal.

Driver for optical modulator

Copackaging of ASIC and silicon photonics

Provided is a burst-mode receiver configured to receive an optical signal having a preamble and a data payload, the burst-mode receiver including a first bias resistor coupled between a first voltage supply and a photosensor, a first capacitor coupled between the photosensor and an amplifier, a first common-mode resistor configured to supply a voltage of a common-mode voltage supply to the amplifier, a first bypass switch configured to couple the first capacitor to the common-mode voltage supply while bypassing the first common-mode resistor, and a first data switch configured to couple the first capacitor to the amplifier, and to couple the first capacitor to the common-mode voltage supply through the first common-mode resistor.

Burst-mode receiver

A DC coupled driver is described for modulating a vertical cavity surface emitting laser at high speeds with active termination. High speed and low total power dissipation is achieved by improving the driver immunity to pulse reflections, which can arise due to impedance mismatch between the driver output impedance and the VCSEL impedance. The rise and fall times of the driver may be adjusted for particular applications. The driver may be fabricated using a choice of bipolar, NMOS and PMOS technologies.

DC coupled driver with active termination

A high precision fast finite impulse response (FIR) filter which periodically samples an analog input signal and holds a sequentially-replaced number of the resulting discrete-time analog values in fixed storage cells while each value is being multiplied by a number of digital weights. The discrete-time analog values are not passed through delay devices and therefore do not degrade. The weights are stored in a memory or shift register and supplied to the multipliers in a repeating sequence. A predetermined number of the weights are set to zero to increase the setup time of the analog multipliers thereby increasing the precision without slowing the clocking frequency.

Growing community of inventors

Fort Collins, CO, United States of America

David Arlo Nelson