Lucent Technologies Inc.

Other

At+t Corp.

At&t Bell Laboratories

Jiangsu Zhongneng Polysilicon Technology Development Co., Ltd.

Ae Polysilicon Corporation

David Anton Mixon

Michael Philip Bohrer

Robert W Froehlich

Anthony E Novembre

Dennis J Trevor

Eric M Monberg

Edwin Arthur Chandross

York Tsuo

Richard M Lum

Linda Ann Psota-Kelty

Ben Fieselmann

Lisa Carol Green

Christopher Nelan

In one embodiment, a method for cooling a reaction effluent gas includes feeding a sufficient amount of a suitable silicon source cooling gas into a stream of the reaction effluent gas, wherein the reaction effluent gas is produced by a thermal decomposition of at least one silicon source gas in a reactor, and wherein sufficient amount of the suitable silicon source cooling gas is defined based a concentration of the at least one chemical species in the reaction effluent gas; cooling the reaction effluent gas to a sufficient temperature so that: the cooled reaction effluent gas is capable of being handled by a material that is not suitable for handling the reaction effluent gas.

Methods and system for cooling a reaction effluent gas

In an embodiment, a reactor includes a section, wherein at least a portion of the section includes a base layer, wherein the base layer has a first composition that contains a silicide-forming metal element; and a silicide coating layer, wherein the silicide coating layer is formed by a process of exposing, at a first temperature above 600 degrees Celsius and a sufficient low pressure, the base layer having a sufficient amount of the silicide-forming metal element to a sufficient amount of a silicon source gas having a sufficient amount of silicon element, wherein the silicon source gas is capable of decomposing to produce the sufficient amount of silicon element at a second temperature below 1000 degrees Celsius; reacting the sufficient amount of the silicide-forming metal element with the sufficient amount of silicon element, and forming the silicide coating layer.

Reactor with silicide-coated metal surfaces

A process produces a glass overcladding tube from a silica gel body. The process includes passing the gel body through a hot zone under conditions that cause partial sintering of the gel body and repassing the gel body through the hot zone under conditions that further sinter the gel body into a glass overcladding tube.

Multi-pass sintering of a sol-gel body through a hot zone

A process deals with gaseous by-products and tarry materials during formation of sol-gel bodies. Gaseous products from a dehydroxylation reactor pass into a gas-fluid contactor. During the early stages of heat treatment, an aqueous acid solution is recirculated through the contactor to trap basic and/or water soluble organic gaseous materials. The resultant solution and non-condensing gases pass into a reservoir. Volatile, undissolved organics exit from the reservoir with non-condensing reactor gases and are treated. Once the organics have burned out of the sol-gel body, recirculation of the aqueous acid solution is ceased, and the gas-fluid contactor is flushed. The water flow is then ceased and dry nitrogen is provided to the contactor. During the next stage of the sol-gel heat treatment, gaseous products from the dehydroxylation reactor pass through the contactor into the caustic scrubber. Once the heat treatment is complete, the contactor is flushed.

Process and apparatus for treating gaseous products of sol-gel manufacturing

It has been found that in sol-gel processes utilizing TMAH, it is possible to treat a trimethylamine (TRIMA)-containing solution with hydrogen peroxide to form trimethylamine oxide--(CH.sub.3).sub.3 N.sup.+ --O.sup.- (TRIMAO), a water soluble compound which is less volatile and less odorous than TRIMA, and which is capable of being sent to a standard wastewater treatment plant. The hydrogen peroxide is generally added to the TRIMA-containing solution in a H.sub.2 O.sub.2 :TRIMA ratio of at least 3:1, advantageously at least 10:1. Because of the resultant TRIMAO solution's ability to be sent to a standard wastewater treatment facility, improved productivity and lowered expense of the overall fiber fabrication process are obtained. The invention is also suitable for treatment of triethylamine.

Process for treating by-product of optical fiber fabrication

A process for enhancing the performance of resist polymers in lithographic processes for device fabrication is disclosed. The resist polymers contain acid labile functional groups. When these functional groups are removed and replaced by hydrogen, the polymer becomes more soluble in the aqueous base developer solutions used in lithographic processes. A portion of the acid-labile functional groups are cleaved from the polymer to obtain a resist polymer with increased sensitivity, improved adhesion, and reduced film shrinkage during post-exposure bake. The acid labile functional groups are cleaved by dissolving the polymer in a suitable solvent and subjecting the mixture to increased temperature until the desired number of acid labile functional groups are cleaved from the polymer. The polymer is then recovered from the mixture and employed as a resist in a lithographic process for device fabrication.

Process for controlled deprotection of polymers and a process for

The present invention is directed to a process for device or mask fabrication. In the process, an energy sensitive resist material that is the combination of a matrix polymer and a modifier polymer is formed onto a substrate. The modifier polymer and matrix polymer are phase compatible. In this regard the modifier polymer has a weight average molecular weight of about 5,000 to about 500,000 g/mol, and at least some of the polymer chains are terminated by a halogen moiety. The resist material is patternwise exposed to radiation, thereby introducing a latent image of the pattern into the resist material. The energy depolymerizes the modifier polymer. The modifier polymer is substantially less soluble in a developer solution used to develop the pattern introduced into the resist than is the matrix polymer. Therefore, if the resist material is positive acting, the resist material that is exposed to radiation is substantially more soluble in developer solution than the unexposed resist material. The developer solution is used to selectively remove the exposed portion of the resist material, thereby developing the pattern introduced into the resist material by the patternwise exposure. The resist material is developed in an interruptive manner to reduce the amount of film loss in the portion of the resist material that is not exposed to radiation.

Energy sensitive resist material and process for device fabrication

Process for fabricating a device utilizing partially deprotected resist

Polymers formed from monomers such as chloromethyl styrene and trimethylgermylmethyl methacrylate form negative-acting resists that are extremely sensitive to exposure by electron beam and deep UV radiation. These materials are particularly useful in bilevel resist applications for fabricating masks or for device processing.

Growing community of inventors

Basking Ridge, NJ, United States of America

David Anton Mixon