Hexcel Composites Limited

Hexcel Corporation

David Allan Tilbrook

Paul Mackenzie

Maureen Boyle

Dana Blair

John Ellis

Emilie Fisset

Martin Richard Simmons

Mark Whiter

Marco Arcidiacono

Emille Fisset

Isabelle Blanc

Christopher Robert Mason

Lucien Fiore

Bernadette Tizon

Lara Jabbour

Armin Heidrich

Paul MacKenzie

Fiona Binks

Martin Simmons

Armin OE Heidrich

This invention relates to a curative composition and its use in curing epoxy resins and prepregs, adhesives and moulded materials derived therefrom. The curative composition comprises a clathrate comprising a host component and a guest component, the host comprising a carboxylic acid or ester compounds as defined or phenolphthalin and the guest comprising an imidazole or imidazoline component.

Curative composition and a resin composition containing the curative composition

A prepreg comprising a structural layer of packed unidirectional conductive fibres comprising thermosetting resin in the interstices, and a first outer layer of resin comprising thermosetting resin, and being essentially free of unidirectional conductive fibres, which when cured under elevated temperature, produces a cured composite material comprising a cured structural layer of packed unidirectional conductive fibres and a first outer layer of cured resin comprising unidirectional conductive fibres dispersed within.

Composite materials

A process for the manufacture of a prepreg comprising feeding a layer of unidirectional conductive fibers having a defined width, bringing into contact with a first face of the fibers a first layer of resin comprising thermosetting resin, and compressing the resin and fibers together by passing over one or more impregnation rollers, wherein the pressure exerted onto the conductive fibers and resin does not exceed 40 kg per centimeter of the width of the conductive fibers, and the resin being in sufficient amount for the resin to enter the interstices of the fibers and leave a first outer layer of resin essentially free of unidirectional conductive fibers.

Process for manufacturing composite materials

A composite material assembly () comprises a) a surface enhancing layer () comprising at least one layer of fibers, having a length to width aspect ratio of more than 5:1 and b) a structural layer () comprising at least one reinforcing fiber and at least one polymeric matrix.

Composite material assembly

Pre-impregnated composite material (prepreg) is provided that can be cured to form composite parts that have high levels of damage tolerance. The matrix resin includes a thermoplastic particle component that is a blend of particles that have a melting point above the curing temperature and particles that have a melting point at or below the curing temperature.

Composite materials with blend of thermoplastic particles

A composite material comprising at least one polymeric resin and optionally at least one fibrous reinforcement, where the polymeric resin comprises; at least one difunctional epoxy resin; and at least one epoxy resin with a functionality greater than two having at least one meta-substituted phenyl ring in its backbone.

Composite materials with improved performance

Pre-impregnated composite material (prepreg) is provided that can be molded to form composite parts that have high levels of both strength and damage tolerance without causing any substantial negative impact upon the physical or chemical characteristics of the uncured prepreg or cured part. This is achieved by including in the matrix resin a substantial amount of a multifunctional aromatic epoxy resin that has at least one phenyl group that is meta-substituted.

Pre-impregnated composite materials with improved performance

A method for making a pre-impregnated composite material (prepreg) is provided. The prepreg can be cured to form composite parts that have high levels of damage tolerance. The matrix resin includes a thermoplastic particle component that is a blend of particles that have a melting point above the curing temperature and particles that have a melting point at or below the curing temperature.

Growing community of inventors

Saffron Walden, United Kingdom

David Allan Tilbrook