Amkor Technology, Inc.

David Albert Zoba

Thomas P Glenn

Paul Robert Hoffman

Kambhampati Ramakrishna

Vincent DiCaprio

Lee John Smith

Donald Craig Foster

Semiconductor packages including at least two semiconductor dies are disclosed. A first die is mounted on a substrate, which may be a metallized laminate or a leadframe. A rigid support structure is mounted on the substrate over the first die. The support structure may be thermally coupled to the substrate, and also may be electrically coupled to the substrate. A second die is mounted on the support structure, which spaces the second die away from the first die. Encapsulant fills the volume within the support structure, including the vertical space between the pair of dies. In an alternative package embodiment, a heat spreader formed of a flexible metal sheet may be thermally coupled between the two stacked dies. The heat spreader transfers heat from the first and second dies to a heat sink of the substrate. The support structure and the heat spreader mitigate the transfer of heat between the first and second dies.

Structures for improving heat dissipation in stacked semiconductor packages

This invention provides a method for making a semiconductor package with stacked dies that eliminates fracturing of the upper die(s) during the wire bonding process. One embodiment of the method includes the provision of a substrate and pair of semiconductor dies, each having opposite top and bottom surfaces and a plurality of wire bonding pads around the peripheries of their respective top surfaces. One die is attached and wire bonded to a top surface of the substrate. A measured quantity of an uncured, fluid adhesive is dispensed onto the top surface of the first die, and the adhesive is squeezed toward the edges of the dies by pressing the bottom surface of the second die down onto the adhesive until the two dies are separated by a layer of the adhesive. The adhesive is cured, the second die is then wire bonded to the substrate, and the dies are then molded over with an encapsulant. The layer of adhesive prevents the second die from shorting the wires on the top of the first die, prevents the second die from being fractured during the wire bonding process, and prevents the encapsulant from forming a thermally expansive wedge between the two dies.

Method of making a semiconductor package including stacked semiconductor dies

In a leadframe type of semiconductor package, the internal electrical interconnectability of and signal routing between multiple dies laminated in a stack with the die paddle of the leadframe is substantially enhanced by laminating an &ldquo;interposer&rdquo; in the stack. The interposer comprises a dielectric layer and a metallic layer patterned to include wire bonding pads arrayed around the periphery of a surface thereof, and circuit traces interconnecting selected ones of the wire bonding pads in a single plane across the horizontal span of the interposer. In packages having multiple dies and relatively few leads, the bonding pads and circuit traces can be flexibly arranged on the interposer by the package designer to substantially increase the number and routings of internal electrical interconnections otherwise possible between the dies and between the dies and the leads of the package.

Making leadframe semiconductor packages with stacked dies and interconnecting interposer

Semiconductor package including stacked semiconductor dies and bond wires

Growing community of inventors

Chandler, AZ, United States of America

David Albert Zoba