Rf Micro Devices, Inc.

Tdk Corporation

Qorvo US, Inc.

David A Zimlich

Chris Levesque

Jean-Christophe Berchtold

Joseph Hubert Colles

David E Jones

Terry J Stockert

William David Southcombe

Scott Yoder

Robert Deuchars

Anuj Madan

Ricke Waylan Clark

Apparatus and methods for temperature compensation of variable capacitors are provided herein. In certain configurations, an integrated circuit (IC) includes a variable capacitor array, an array biasing circuit that biases cells of the variable capacitor array to control the array's capacitance, and a bias voltage level control circuit that generates one or more temperature dependent bias voltages used by the array biasing circuit to bias the variable capacitor array's cells. The bias voltage level control circuit controls the one or more temperature dependent bias voltages to change with temperature so as to compensate the variable capacitor array for changes to capacitance arising from temperature variation.

Apparatus and methods for temperature compensation of variable capacitors

A direct current (DC)-DC converter, which includes a charge pump buck power supply and a buck power supply is disclosed. The charge pump buck power supply includes a charge pump buck converter, a first inductive element, and an energy storage element. The charge pump buck converter and the first inductive element are coupled in series between a DC power supply, such as a battery, and the energy storage element. The buck power supply includes a buck converter, a second inductive element, and the energy storage element. The buck converter and the second inductive element are coupled in series between the DC power supply and the energy storage element. As such, the charge pump buck power supply and the buck power supply share the energy storage element.

Dual inductive element charge pump buck and buck power supplies

Analog-to-digital pulse width modulation circuitry includes thermometer code generator circuitry, clock generator circuitry, delay selection circuitry, and an output stage. The thermometer code generator circuitry is adapted to generate a digital thermometer code based upon a received analog input voltage. The clock generator circuitry is adapted to generate a reference clock and a plurality of delayed clock signals. The delay selection circuitry is connected between the thermometer code generator circuitry and the clock generator circuitry, and is adapted to select one of the delayed clock signals to present to the output stage based upon the generated thermometer code. The selected delayed clock signal is delayed by an amount of time that is proportional to the generated thermometer code. The reference clock signal and the selected delayed clock signal are delivered to the output stage where they are used to generate a pulse width modulated output signal.

Analog-digital pulse width modulator (ADPWM)

The present disclosure relates to a flexible direct current (DC)-DC converter, which includes a charge pump buck power supply and a buck power supply. The charge pump buck power supply and the buck power supply are voltage compatible with one another at respective output inductance nodes to provide flexibility. In one embodiment of the DC-DC converter, capacitances at the output inductance nodes are at least partially isolated from one another by using at least an isolating inductive element between the output inductance nodes to increase efficiency. In an alternate embodiment of the DC-DC converter, the output inductance nodes are coupled to one another, such that the charge pump buck power supply and the buck power supply share a first inductive element, thereby eliminating the isolating inductive element, which reduces size and cost but may also reduce efficiency.

Voltage compatible charge pump buck and buck power supplies

DC to DC converter circuitry includes a dual phase charge pump and at least one pair of multiplier phase circuits. The dual phase charge pump is coupled to each one of the at least one pair of multiplier circuits and adapted to receive a DC input voltage and only four control signals, and produce a stepped-up output voltage. Each one of the at least one pair of multiplier phase circuits are adapted to receive the stepped-up output voltage, a cross-coupled control signal from the other multiplier phase circuit in the pair of multiplier phase circuits, and a different one of the control signals and further multiply the stepped-up output voltage to produce a multiplied stepped-up output voltage with a magnitude that is approximately three times that of the DC input voltage or greater.

Voltage multiplier charge pump buck

At least a first shunt switching element and switching control circuitry of a first switching power supply are disclosed. At least the first shunt switching element is coupled between a ground and an output inductance node of the first switching power supply. The first switching power supply provides a buck output signal from the output inductance node. The switching control circuitry selects one of an ON state and an OFF state of the first shunt switching element. When the buck output signal is above a first threshold, the switching control circuitry is inhibited from selecting the ON state. The first switching power supply provides a first switching power supply output signal based on the buck output signal. By using feedback based on the buck output signal, the switching control circuitry may refine the timing of switching between series switching elements and shunt switching elements to increase efficiency.

Feedback based buck timing of a direct current (DC)-DC converter

A hybrid Direct Current (DC) to DC converter is disclosed for efficiently converting an input voltage from one level to another. In a preferred embodiment, a dual phase charge pump is combined with a buck converter and a switch controller to provide a converted voltage that is useable to cellular handset circuits based on power amplifier (PA) technology.

Hybrid DC/DC power converter with charge-pump and buck converter

A direct current (DC)-DC converter having a DC-DC converter semiconductor die and an alpha flying capacitive element is disclosed. The DC-DC converter semiconductor die includes a first series alpha switching element, a second series alpha switching element, a first alpha flying capacitor connection node, which is about over the second series alpha switching element, and a second alpha flying capacitor connection node, which is about over the first series alpha switching element. The alpha flying capacitive element is electrically coupled between the first alpha flying capacitor connection node and the second alpha flying capacitor connection node. By locating the first alpha flying capacitor connection node and the second alpha flying capacitor connection node about over the second series alpha switching element and the first series alpha switching element, respectively, lengths of transient current paths may be minimized, thereby reducing noise and potential interference.

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Carlsbad, CA, United States of America

David A Zimlich