Sandisk Technologies Inc.

David A Wright

Robert W Ellis

David Lee Dean

Various embodiments described herein include systems, methods and/or devices used to dissipate heat generated by electronic components in an electronic system (e.g., a memory system including closely spaced memory modules). Specifically, a heat sink includes an attachment structure and a tab. The attachment structure defines a slot configured to receive an edge of a substrate and thermally couple to a ground plane of the substrate. The tab is located opposite to the slot, and is configured to slide into a card guide slot of an assembly rack, such that in use, heat generated by at least one electronic component on the substrate is at least partially transferred through the ground plane to the attachment structure to be dissipated.

Heat dissipation for substrate assemblies

Various embodiments described herein include systems, methods and/or devices used to dissipate heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one aspect, an electronic system includes a substrate, at least one electronic component, and a heat sink. The at least one electronic component is mechanically coupled to the substrate and thermally coupled to a ground plane of the substrate, such that heat generated by the at least one electronic component is dissipated at least partially to the ground plane of the substrate. The heat sink is mechanically coupled to an edge of the substrate, and thermally coupled to the ground plane of the substrate to at least partially dissipate the heat generated by the at least one electronic component. In some embodiments, the heat sink further includes an attachment structure, a tab and a plurality of heat dissipaters.

Growing community of inventors

Sun Tan Valley, AZ, United States of America

David A Wright