Amoco Corporation

The University of Texas System

David A Wargowski

Douglas E Fjare

Marvin J Burgess

Allyson J Beuhler

Agnes M Palka

Wen-Feng Liu

David P Sinclair

Robert T Roginski

Paul A Sanchez

Donald E Rubis

Herbert J Neuhaus

Terre L VanKirk

John T Hoback

Compositions for forming polymeric layers useful in the manufacture printed wiring boards and other electrical interconnecting devices are disclosed. The compositions typically are processable in aqueous base and can be made photosensitive with the addition of a positive acting photosensitive compound. The compositions are particularly useful in the manufacture of laminable films used to make printed wiring boards. Multilayer printed wiring boards made using such films, and methods for making and using the films and boards, also are disclosed.

Photoimageable compositions and films for printed wiring board manufacture

Polyimide optical waveguide structures comprising a core within a cladding wherein at least one of the core and the cladding is a polyimide containing 6FDA; and the complementary portion of the waveguide structure is a polyimide having partial replacement of the 6FDA of the core or cladding composition by BPDA, and wherein the difference in the birefringence of the core and cladding are less than the difference in the refractive index. Copolyimides containing 6FDA and BPDA moieties, and at least one diamine, which have properties useful in optical applications including adjustable refractive index and controllable birefringence, low optical losses, low optical absorbance, increased solvent resistance, and high thermal stability. A method for adjusting the refractive index to make useful copolyimide core/cladding waveguide structures by controlling the 6FDA/BPDA ratio.

Polymide optical waveguide structures

Polyimide optical waveguide structures comprising a core within a cladding wherein at least one of the core and the cladding is a polyimide containing 6FDA, BTDA, an aromatic diamine having bulky methyl groups ortho to the amine, and a co-diamine wherein the polyimides have the properties of low optical loss, low optical absorbance, controllable refractive index, and high thermal stability, and wherein the polyimides are photosensitive and solvent resistant.

Copolyimide exhibiting specific photosensitivity and birefringence

Photodefinable optical waveguides

A polyimide layer having a thickness greater than about 5 microns is formed on a substrate by coating a substrate with a solution of polymer and a solvent of the formula ##STR1## wherein R.sub.1 and R.sub.2 are independently a hydrogen, a C.sub.1 to C.sub.6 alkyl moiety, or a ##STR2## R.sub.5 is a C.sub.1 to C.sub.6 alkyl moiety; and R.sub.3 and R.sub.4 are independently hydrogen or a C.sub.1 to C.sub.6 alkyl moiety, and curing the resulting coated substrate.

Process for making thick multilayers of polyimide

A low modulus, solvent resistant, wet etchable polyimide useful in electronic applications as passivation and insulating coatings, said polyimides containing a 4,4'-bis(p-aminophenoxy)biphenyl moiety, a siloxane diamine moiety, and a dianhydride moiety.

Polyimide copolymers containing 4,4'-bis(p-aminophenoxy)biphenyl and

A low modulus, solvent resistant, wet etchable polyimide useful electronic applications as passivation and insulating coatings, said polyimides containing a 4,4'-bis(p-aminophenoxy)biphenyl moiety, a siloxane diamine moiety, and a dianhydride moiety.

Growing community of inventors

Naperville, IL, United States of America

David A Wargowski