Gm Global Technolgoy Operations, Inc.

David A Smith

Lisa M Albaugh

Timothy J Guse

A thermally conductive thick film dielectric ink for an electronic device includes a mixture of an organic medium, a glass binder, and a technical ceramic powder having ceramic particles dispersed throughout the thick film dielectric ink mixture.

Dielectric thick film ink

Disclosed herein are a variety of embodiments of thick film circuits with conductive components formed using different conductive elements and related methods for forming such circuits. One embodiment consistent with the present disclosure includes a multi-level thick film circuit formed on a substrate and having a first layer disposed on the substrate. The first layer may include a first conductive component formed using a first conductive element. The first conductive element may be a precious metal. The circuit may further include a second layer having a second conductive component. The second conductive component may be formed using a second conductive element. In one embodiment, the second conductive element may be a base metal. At least a portion of the first conductive element may directly contact at least a portion of the second conductive element such that the first layer is in electrical communication with the second layer.

Thick film circuits with conductive components formed using different conductive elements and related methods

Thick film conductive inks for electronic devices, methods for making electronic devices using thick film conductive inks, and electronic devices fabricated by such methods are provided herein. In one example, a thick film conductive ink includes an organic portion and an inorganic portion. The inorganic portion is dispersed in the organic portion to define a paste. The inorganic portion includes metallic copper powder, cupric oxide, and elemental boron. The thick film conductive ink includes substantially no glass.

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Kokomo, IN, United States of America

David A Smith