Dow Corning Corporation

David A Sierawski

David Joseph Romenesko

Steven Walter Wilson

Robert C Antonen

Beth Ann Witucki

Diane M Rasch

The combination of reduced flammability and adhesion can be imparted to cured organosiloxane materials when the curable compositions used to prepare these materials contain 1) an adhesion promoting composition comprising up to about 0.1 weight percent, based on the weight of the curable composition, of a chelated organoaluminum compound in combination with an organic epoxide compound and an alkoxysilane or condensation product of the silane, and 2) as a flame-retarding additive, hydrated aluminum oxide and/or magnesium hydroxide, preferably in combination with additional fillers such as quartz.

Organosiloxane compositions yielding cured products exhibiting adhesion

Thixotropic, silica-filled coating compositions wherein the curable film-forming material is an organosiloxane copolymer resin include a liquid polydiorganosiloxane containing hydroxyl-terminated polyoxypropylene units as the flow control agent. The compositions are particularly useful as screen printable passivation coatings for semiconductor devices.

Screen printable organosiloxane resin coating compositions

Mixing vinyl-containing polyorganosiloxane, a silicon-bonded hydrogen containing organosilicon compound, a platinum catalyst, a polysiloxane having at least two silicon-bonded vinyl radicals and at least one silicon-bonded hydroxyl radical and an epoxy-containing, alkoxy silane provides a silicone gel which discolors less on aging than other platinum catalyzed silicone gels. An example of the polysiloxane is a hydroxyl endblocked polymethylvinylsiloxane and an example of the epoxy silane is ##STR1##

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Midland, MI, United States of America

David A Sierawski