Apple Inc.

David A Karol

Sean M Gordoni

Daniel J Morizio

Matthew D Hill

Benjamin J Pope

Sawyer Isaac Cohen

Lucy Elizabeth Browning

Eric N Nyland

Ihtesham H Chowdhury

Devon A Monaco

Nicholas W Ruhter

Sherry Lee

Arun R Varma

Bryan D Keen

James W Bilanski

Lior Ben-Yehoshua

Abhishek Choudhury

Date Jw Noorlag

Zhong J Ma

Zachary P Jasensky

Ali Navrozally

Yaodong Wang

Scott D Hector

Systems and methods are provided for detecting defects caused by cracks in an integrated circuit, which may arise during or after a silicon wafer is singulated into separate integrated circuits. An integrated circuit may include crack detection circuitry including a metal circuit. The metal circuit may fracture or break due to crack propagation through a portion of the integrated circuit. In the event of a crack, testing may detect the fracture of the metal circuit. The crack detection circuitry may also detect accurate operation of circuitry of the integrated circuit.

Systems and methods for silicon crack detection structure

An assembly is provided that includes a printed circuit board, a transceiver integrated circuit mounted on a first surface of the printed circuit board, and an antenna module having multiple antennas and that is mounted on a second surface of the printed circuit board. The antenna module at least partially overlaps with the transceiver integrated circuit in an overlap region. The antenna module is electrically coupled to the transceiver integrated circuit via direct passthrough signal connections that extend from the first surface to the second surface. The direct passthrough signal connections are located within the overlap region. Each of the direct passthrough signal connections can be implemented using through-board stacked via structures. The antenna module can include multiple layers of signal routing lines for distributing the signals from the direct passthrough signal connections to the various antennas on the antenna module.

Printed circuit board with passthrough signal connections between a radio-frequency system and an antenna module

A wireless power system may include an electronic device. The electronic device can include a camera and wireless power circuitry configured to perform a wireless power transfer operation with an external device. To promote coexistence of the camera with the wireless power circuitry, the electronic device can alter the wireless power transfer operation.

Coexistence with wireless power system

A portable electronic device includes a housing defining an internal volume and a circuit board assembly within the internal volume. The circuit board assembly includes a first circuit board, a wall structure soldered to the first circuit board, and a second circuit board soldered to the wall structure and supported above the first circuit board by the wall structure. The second circuit board defines an exterior top surface of the circuit board assembly. A processor is coupled to the first circuit board and positioned within an internal volume defined between the first circuit board and the second circuit board and at least partially surrounded by the wall structure. A memory module is coupled to the exterior top surface of the circuit board assembly.

Handheld electronic device

Growing community of inventors

San Francisco, CA, United States of America

David A Karol