Celis Semiconductor Corporation

Em Microelectronic-marin Sa

Landec Corporation

Other

David A Kamp

Ray F Stewart

Steven P Bitler

Gary F Derbenwick

David D Taft

Valentine Y Yoon

Michael V Cordoba

Edward E Schmitt

Thierry Roz

Filippo Marinelli

Andrew W Larson

Lawrence C Greene

George B Coombe

Thomas W Ross

Ryan Tasuo Hirose

Alan D DeVilbiss

James J Springer

Donald A Schultz

Robert G Freelin

Mark A Wanthal

Nicolas Pillin

Paul A Meyers

Troy A Meester

An RFID transponder chip includes at least one antenna to pick-up and transmit radio-frequency signals, a rectifier to store charge on at least one capacitor at a rectified voltage from the picked-up radio-frequency signals, a power-on reset circuit to maintain a logic unit in a reset state if the rectified voltage level is less than a power-on reset or wake-up voltage of the power-on reset circuit for operating the logic unit. The RFID transponder chip further includes a non-volatile memory, in which are stored one or several trim values. Said non-volatile memory is directly connected to the power-on reset circuit to be able to provide at least one trim value to trim the power-on reset circuit at a rectified voltage level below a wake-up voltage level.

RFID transponder chip with a programmable wake-up

A RFID transponder includes an electronic circuit and an antenna, the electronic circuit being integrated in a p-type substrate and comprising a modulator formed by a PMOS transistor whose drain, electrically connected to a pad of the antenna, and source, connected to the ground of the electronic circuit, are arranged in an n-type well provided in the p-type substrate. The PMOS transistor has a gate driven by a driving circuit which is arranged for providing at least a negative voltage, this negative voltage being low enough for turning on this PMOS transistor in response to a control signal provided by a logical unit of the electronic circuit.

Transponder with a modulator

The self-powered detection device comprises a Non-Volatile Memory (NVM) unit formed by at least a NVM cell and a sensor activated by a physical or chemical action or phenomenon, the NVM unit arranged for storing in the NVM cell, by using electrical power of the electrical stimulus pulse, a bit of information relative to detection by the sensor, during a detection mode of the self-powered detection device, of at least one physical or chemical action or phenomenon applied to it with at least a given strength or intensity and resulting in a voltage stimulus signal provided between a set control terminal and a base terminal of the NVM unit with at least a given set voltage.

Self-powered detection device with a non-volatile memory

The self-powered detection device comprises a non-volatile memory cell and a sensor activated by a physical or chemical action or phenomenon, this sensor forming an energy harvester transforming energy from the physical or chemical action orphenomenon into an electrical stimulus pulse, the memory cell arranged for storing, by using electrical power of the electrical stimulus pulse, at least a bit of information relative to detection by the sensor of at least a first physical or chemical action or phenomenon. The non-volatile memory cell comprises a FET transistor having a control gate, a first diffusion defining a first input and a second diffusion defining a second input. This FET transistor is set to its written logical state from its initial logical state when, in a detection mode, it receives on a set terminal a voltage stimulus signal resulting from the first physical or chemical action or phenomenon.

Self-powered event detection device

The self-powered detection device comprises a Non-Volatile Memory (NVM) unit () formed at least by a NVM cell and a sensor which is activated by a physical or chemical action or phenomenon, this sensor forming an energy harvester that transforms energy from said physical or chemical action or phenomenon into an electrical stimulus pulse, said NVM unit being arranged for storing in said NVM cell, by using the electrical power of said electrical stimulus pulse, a bit of information relative to the detection by said sensor, during a detection mode of the self-powered detection device, of at least one physical or chemical action or phenomenon applied to it with at least a given strength or intensity and resulting in a voltage stimulus signal provided between a set control terminal (SET) and a base terminal (SET *) of said NVM unit with at least a given set voltage. The self-powered detection device comprises a read circuit () or is arranged to be coupled to such a read circuit and further comprises a clamp circuit () located between the sensor and the NVM unit, this clamp circuit being arranged for passing said voltage stimulus signal on a set line connecting the sensor and the set control terminal of the NVM unit, this voltage stimulus pulse having a polarity corresponding to a set polarity of said NVM cell, and for blocking other voltage signals having approximately an amplitude corresponding to said set voltage or higher and an inverse polarity relative to the set polarity of said NVM cell, in order to avoid a possible erase of this NVM cell by such other voltage signals.

Novel modifying agents contain a sharply-melting crystalline polymer ingredient, preferably a side chain crystalline (SCC) ingredient, and an active chemical ingredient. Such modifying agents, especially when in the form of particles, can be placed in contact with a matrix, will not modify the matrix below the crystalline melting point T , but will rapidly modify the matrix above T . The active chemical ingredient can react with the matrix, catalyze a reaction of the matrix, or inhibit a reaction of the matrix. Particularly useful compositions are polymer precursors which are storage-stable at low temperatures but which are rapidly converted to crosslinked resins when heated to temperatures above T , optionally in the presence of light.

Polymeric modifying agents

A ferroelectric field effect transistor (FET) has a gate, source, drain, and substrate. A negative voltage is applied to the gate. Ground potential is applied to the source, drain, and substrate. The negative voltage has a magnitude at least equal to the coercive voltage of the FET. A positive voltage is then applied to the gate. Ground potential is applied to the source and substrate. The positive voltage is no less than the coercive voltage. Either a positive voltage or a ground potential is applied to the drain to write a logic state to the FET. A voltage is applied to the gate. Ground potential is applied to the source. A positive voltage is applied to the drain. The drain current is measured and compared to a compare current. The relative size of the drain current compared to the compare current is indicative of the stored logic state in the FET.

Method of writing ferroelectric field effect transistor

A ferroelectric integrated circuit memory device includes: a plurality of memory cells, each including a ferroelectric material, a plurality of conducting lines, each connected to or connectable to a selected one of the memory cells; a drive circuit for applying a predetermined voltage for a predetermined time to a selected one of the conducting lines, the predetermined voltage and time being the normal voltage and time required to perform write or read functions to the memory cell, a function selected from the group of: writing a logic state to the selected memory cell, and reading the selected memory cell; and a mode control circuit responsive to an external signal for adjusting the predetermined voltage or the predetermined time to perform an operation selected from the group consisting of: a partial read of the selected memory cell, and a partial write of the selected memory cell; and applying ferroelectric stress to the memory cell. A known logic state is written to the memory cells, the cells are heated, and then read to provide output data indicative of the likelihood of premature failure for each of the memory cells. Ferroelectric stress is applied to the cells either before or after the cells are written to by repeatedly applying a voltage to the cells corresponding to a logic state opposite that of the written logic state.

Apparatus and method for testing ferroelectric memories

A ferroelectric memory includes memory cells comprising a transistor having a source/drain, a ferroelectric capacitor having a first electrode and a second electrode. A plate line is connected to each of the second electrodes. In each memory cell, the first electrode is connected to the source/drain of the transistor to create a node that is isolated when the transistor is off. A shunt system directly electrically connects the isolated nodes of a pair of memory cells at a predetermined time to essentially equalize the voltages on the nodes. The shunt may be a Schottky diode, a resistor, and a pair of back-to-back diodes, or a transistor. In the embodiment in which the shunt is a transistor, the shunt line connected to the shunt transistor gate is boosted, there is a shunt transistor connecting each isolated node in a portion of the memory to the adjacent isolated node, and every eight to thirty-two isolated nodes, another shunt transistor connects the chain of isolated nodes to the plate line.

Ferroelectric memory with shunted isolated nodes

A ferroelectric destructive read-out memory system includes a power source, a memory array including a memory cell, and a logic circuit for applying a signal to the memory array. Whenever a low power condition is detected in said power source, a disturb prevent circuit prevents unintended voltages due to the low power condition from disturbing the memory cell. The disturb prevent circuit also stops the operation of the logic circuit for a time sufficient to permit a rewrite cycle to be completed, thereby preventing loss of the data being rewritten.

Electronic memory with disturb prevention function

A timing circuit produces a clock signal. An address buffer circuit receives and stores a first address in a first latch and a second address in a second latch asynchronously with respect to the clock signal. A memory control circuit associated with an array of memory cells accesses a first memory cell in the array corresponding to the first address in a first clocked access cycle, and accesses a second memory cell in the array corresponding to the second address in a second clocked access cycle. If a further address is asynchronously received before said second access cycle, the further address replaces the second address in the second latch.

Asynchronously addressable clocked memory device and method of operating same

A ferroelectric integrated circuit memory includes a memory cell having a first ferroelectric capacitor, one electrode of which is connected to a first bit line through a first transistor and the other electrode of which is connected to a plate line; and a second ferroelectric capacitor, one electrode of which is connected to a second bit line through a second transistor and the other electrode of which is connected to the plate line. The plate line is parallel to the bit lines. The plate line is at 1/2 Vdd. The cell is written to by driving both bit lines either to Vdd or zero volts. The cell is read by driving one bit line to Vdd and the other to zero volts, and sensing the voltage change on the plate line. A shunt system holds the isolated node to the same voltage as the plate line when the row is not selected, thus providing a ferroelectric memory architecture that is unaffected by changes, such as aging, in the ferroelectric material, and has no disturb voltages.

Ferroelectric memory with two ferroelectric capacitors in memory cell

A ferroelectric integrated circuit memory includes a memory cell having a ferroelectric capacitor, one electrode of which is connected to a bit line through a transistor, and the other electrode of which is connected to a plate line. The bit line is also connected to system ground through a precharge transistor. In a read cycle, the precharge transistor remains on after the word line goes high connecting the capacitor to the bit line. At least a portion of the linear displacement current that flows to the bit line is drained off to ground via the precharge transistor, thereby increasing the switching voltage across the ferroelectric capacitor. The precharge transistor is turned off before or during the switching of the ferroelectric capacitor. The signal applied to the gate of the precharge transistor is boosted above the supply voltage of the memory to shorten the cycle time.

Ferroelectric memory with increased switching voltage

A ferroelectric integrated circuit memory includes a memory cell having a ferroelectric capacitor, one electrode of which is connected to a bit line through a transistor and the other electrode of which is connected to a plate line. The plate line is floating at one-half Vcc when the bit line is lowered to zero volts to develop a read voltage on the plate line. A unity gain amplifierthen drives a complementary plate line to the same voltage as the plate line, then the plate line and complementary plate line are connected via a transistor, and the bit line is raised to Vcc to develop a reference voltage. This operation subtracts the read voltage from the reference voltage to develop a net voltage on the complementary plate line. The voltage on the complementary plate line is applied to the output line, compared via a sense amplifier to a one-half Vcc voltage on the input line, and the sense amp then drives the input and output lines to zero and Vcc, depending on whether the developed voltage was greater or less than one-half Vcc.

Self-referencing ferroelectric memory

A ferroelectric memory includes a transistor having a source/drain, a capacitor having a first electrode and a second electrode, and a plate line connected to the second electrode. The first electrode is connected to the source/drain of the transistor to create a node that is isolated when the transistor is off. A shunt system directly electrically connects the isolated node and the second electrode of said capacitor at a predetermined time to essentially equalize the voltages on the first and second electrodes of said capacitor during the predetermined time. In different embodiments the shunt is a Schottky diode, a resistor, and a pair of back-to-back diodes and a transistor. In the embodiment in which the shunt is a transistor, the shunt line connected to the shunt transistor gate is boosted, there is a shunt transistor connecting each isolated node in a portion of the memory, to the adjacent isolated node, and every eight to thirty-two isolated nodes, another shunt transistor connects the chain of isolated nodes to the plate line.

Growing community of inventors

Monument, CO, United States of America

David A Kamp