Intel Corporation

Intel Corproation

David A Jones

Michael T Crocker

Peter A Davison

Rolf A Konstad

Thomas J Wong

Mike MacGregor

An advanced zero-insertion force (ZIF) socket for coupling an electronic package having a plurality of electrical pins and a heat sink having a heat sink alignment and retention means onto a printed circuit board (PCB) of a computer system. Such a ZIF socket comprises a base having a plurality of receptacles adapted to receive electrical pins of an electronic package; a top plate slidably mounted on the base, having a plurality of pin insertion apertures adapted to permit insertion of the electrical pins of the electronic package; and a cam mechanism which is operable for sliding the top plate over the base in a first direction to permit insertion of the electrical pins of the electronic package into respective apertures of the base, and for sliding the top plate over the base in a second direction opposite to the first direction to secure an electrical coupling of the electrical pins of the electronic package with the receptacles of the base while simultaneously securing the heat sink in place on top of the electronic package and the base, via the heat sink retention means.

Advanced zero-insertion force (ZIF) socket with heat sink alignment and retention mechanisms

A fastener for an electronic assembly. The fastener may have a spring arm that extends from a stem. The fastener can attach a cover to a heat sink of an electronic assembly. The stem may be inserted into a boss of the cover. The spring arm may exert a force onto the heat sink to press the sink into an integrated circuit package of the assembly.

Heat sink clip for an electronic assembly

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El Dorado Hills, CA, United States of America

David A Jones