University of California

Kennametal Inc.

Aluminum Company of America

David A Dornfeld

Richard Len Lemaster

Jianshe Tang

Keith A McMillen

James M Story

Rhett D Gentile

Jinsu Choi

John G Horne

Yung-Chih Chen

Sunghoon Lee

Jennifer Dai

Raunak Bhinge

Wojciech Musial

A universal manufacturing vise jaw plate for use on a machine tool with a vise fixture, and configured for real-time operational data collection and analysis. The vise plate comprises a combination of acoustic and vibration sensors with a plate for cutting tool monitoring applications.

Acoustic and vibration sensing apparatus and method for monitoring cutting tool operation

A polishing pad for use with a polishing composition is disclosed. The polishing pad includes a layer having a first material, and polishing structures having a second material, where the plurality of polishing structures form a temporary reservoir region for the polishing composition. The second material is harder than the first material.

CMP pad with designed surface features

The chemical-mechanical polishing (CMP) of products in general and semiconductor wafers in particular is controlled by monitoring the acoustic emissions generated during CMP. A signal is generated with the acoustic emissions which is reflective of the energy of the acoustic emissions. The signals are monitored and the CMP process is adjusted in response to a change in the acoustic emission energy. Changes in the acoustic emission energy signal can be used to determine the end-point for CMP, particularly when fabricating semiconductor wafers for planarizing/polishing a given surface thereof. Long-term changes in the acoustic emission energy signals resulting from process changes including, for example, wear of the polishing pad, can also be detected with the acoustic emission energy signals so that desired or necessary process adjustments, such as a reconditioning of the polishing pad, for example, can be effected or the process can be stopped or an alarm signal can be generated when unacceptable process abnormalities occur.

Semiconductor wafer chemical-mechanical planarization process monitoring and end-point detection method and apparatus

A method of superplastically forming a part from a blank of material. The blank is placed between opposed die structures and heated to a superplastic forming temperature. Positive fluid pressure is supplied at an increasing rate against a front surface of a blank to stretch the same into a cavity of one of the dies to begin formation of the part. A positive fluid pressure is also applied against the back surface of the blank, and acoustical energy emitted by the material of blank resulting from the occurrence of cavitation in the material is sensed. The sensing of acoustical energy is employed to control one or more of the above parameters until the formation of the cavities substantially reduces or ceases altogether.

Control of cavitation in superplastic forming through use of acoustic

An acoustic emission transducer has an improved design and mounting arrangements for using it to monitor machine tool operating condition. The transducer has a hollow housing with external threads capable of making a threaded mounting connection through which acoustic emission energy generated by operation of a machine tool propagates and is then transmitted by the housing. Also, a wear plate is attached to one end of the externally-threaded housing and supports a piezoelectric detecting element in the housing. The plate is capable of transmitting acoustic emission energy and the detecting element is capable of detecting it and generating an electrical signal in response thereto. In a surface mounting arrangement of the transducer, an adapter is used in mounting the transducer to a surface of the machine tool support structure. In an integral mounting arrangement of the transducer, the housing of the transducer is threaded directly into an internally threaded cavity in the machine tool support structure. In both mounting arrangements, a contact ball is disposed in a recess formed in the machine tool support structure below the transducer plate for providing acoustic emission energy transmitting contact between the transducer plate and the machine tool support structure.

Acoustic emission transducer and mounting adapter for monitoring

Method and apparatus for evaluating the density profile of a wood-derived specimen. A sample of the material is mounted on a lathe and rotated at high speed. An acoustic emission transducer is coupled to a cutting tool, brought into contact with the specimen to produce an AE signal, as the tool is moved across the thickness of the rotating sample. The acoustic emission signal is then transformed into an electrical signal and the resultant electrical signal is amplified and transmitted to a second amplifier for further amplification and analysis of the signal.

Method and apparatus for measurement of density profiles in wood

Method and apparatus for determining vertical density profiles in wood composites. A fly cutter is rotated across the edge of a wood composite panel to produce acoustic emissions that themselves produce an RMS voltage. The changes is RMS voltage so produced are recorded and thereby the acoustic emission is recorded. The detected signal is transformed into electrical signals, amplified and transmitted to a suitable detecting transducer.

Growing community of inventors

Berkeley, CA, United States of America

David A Dornfeld