Applied Materials, Inc.

Adac Laboratories, Inc.

Bentek Corporation

David A Chan

Manoocher Birang

Boguslaw A Swedek

Bret W Adams

Sanjay Rajaram

Fred Conrad Redeker

Rajeev Bajaj

Stan D Tsai

Horace H Hines

Andreas Norbert Wiswesser

Paul M Hug

Mitchell Schoch

Savitha Nanjangud

Konstantin Y Smekalin

Robert L Kay

Steven M Jones

Matthew J Murphy

James Peplinski

Kenneth G Bayer

Mark S Fasnacht

Jim Peplinski

Douglas C Watson

Various embodiments provide safety disconnect systems for a power system. In one aspect, a safety disconnect system includes an enclosure operative to receive a plurality of input power lines into the enclosure and provide a plurality of output power lines out of the enclosure. Each input power line is coupled to and paired with a corresponding one of the output power lines, where each input power line and output power line is operative to provide power from a power source. A plurality of switches are provided in the enclosure, each of these switches coupled between an associated one of the pairs of input power line and output power line, and each switch operative to disconnect the associated input power line from the corresponding output power line.

Integrated safety disconnects for power systems

A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.

Computer-implemented process control in chemical mechanical polishing

Polishing system with in-line and in-situ metrology

Computer-implemented method for process control in chemical mechanical polishing

A CMP station can be closed loop controlled by using data obtained by an inline metrology station from a first polished wafer to affect the processing of subsequent polished wafers. The first wafer is polished and measured by the inline metrology station. The metrology station measures at various points the array dielectric thickness, field dielectric thickness, barrier residue thickness and metal residue thickness. The data is then inputted into an algorithm and polishing parameter outputs are calculated. The outputs are sent to the CMP station and used to supplement or replace the previous polishing parameters. Subsequent wafers are polished on the CMP station using the revised polishing parameters.

Methods and apparatus for polishing control

A computer program product for process control in chemical mechanical polishing is described. The product includes instructions to cause a processor to receive a measurement of an initial pre-polishing thickness of a layer of a substrate from a metrology station, determine a value for a parameter of an endpoint algorithm from the initial thickness of the substrate, receive a monitoring signal generated from monitoring in-situ polishing of the substrate, process the monitoring signal to detect a signal feature indicating a final or intermediate endpoint and send instructions to stop polishing when an endpoint criterion is detected using the endpoint algorithm with the determined value for the parameter.

An optical monitoring system for a two-step polishing process which generates a reflectance trace for each of plurality of radial zones. The CMP apparatus may switch from a high-selectivity slurry to a low-selectivity slurry when any of the reflectance traces indicate initial clearance of the metal layer, and polishing may halt when all of the reflectance traces indicate that oxide layer has been completely exposed.

Optical monitoring in a two-step chemical mechanical polishing process

An automatic collimator exchanger for a gamma camera system for simultaneous exchange of pairs of collimators (or a single collimator) for a dual detector head system. The present invention includes an exchange assembly having an elevator, a carriage and a bridge. The elevator includes a rack of multiple parallel and stacked trays for holding various pairs of collimators. A draw bridge unit is attached to one side of the elevator (which side faces a gantry structure) and may extend into the gantry structure. The carriage is able to support two collimators and moves from within the elevator unit onto the bridge and into the gantry structure, when the bridge is lowered, to position between two aligned detector heads of the dual head gamma camera system. When the detector heads are positioned near the aligned carriage, latch pins are released and collimators may be transferred to the carriage, if empty, or hastened to the detector heads from the carriage when installing a pair of collimators. Sliding lock plates (each having hooks and a safety latch pin) are mounted on both sides of each of the detector heads and are used to transfer the collimators between the carriage and the detector heads during the exchange (for removal and installation) and are used to secure the collimators to the detector heads during an imaging session. One collimator or a pair may be simultaneously exchanged using the present invention without operator intervention.

Apparatus and method for automated collimator exchange

A direct measurement system for proximity detection of a body profile for use within nuclear medicine. The measurement system includes two or three proximity detector units mounted on a gantry structure of a nuclear medicine camera which each emit an energy beam which is swept across a portion of a target body. Each detector is capable of directly measuring the distance from the proximity detector unit to the target body with a beam sample. The detectors then create a body profile of the target body which is used to minimize the distance between the collimator of a scanning camera and the target body surface thus improving image quality of the scanning camera. There is relative motion between the object and the gantry along a cranial-caudal axis of a target body for scanning successive body profiles. Successive body profiles are combined together to achieve a complete body contour of the target body. The proximity detector units are stationary with respect to movement of the scanning camera toward said target body. Body contour data is also used for attentuation correction.

Proximity detector for body contouring system of a medical camera

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Sunnyvale, CA, United States of America

David A Chan