Motorola Corporation

Freescale Semiconductor,inc.

Dave S Mahadevan

Bishnu Prasanna Gogoi

David Joseph Monk

Gary G Li

Kyujin Jung

Arvind S Salian

Theresa A Maudie

Gordon D Bitko

Michael E Chapman

Bill McDonald

Michael E S Chapman

D Lawrence Boughter

Song Woon Kim

An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed by forming a conductive layer () over a mold encapsulant (). The conductive layer () may be electrically coupled using a wire to the leadframe () of the semiconductor package (). The electrical coupling can be performed by wire bonding two device portions () of a leadframe () together and then cutting the wire bond () by forming a groove () in the overlying mold encapsulant () to form two wires (). The conductive layer () is then electrically coupled to each of the two wires (). In another embodiment, a looped wire bond () is formed on top of a semiconductor die (). After mold encapsulation, portions of the mold encapsulant () are removed to expose portions of the looped wire bond (). The conductive layer () is then formed over the mold encapsulant () and the exposed portion of the looped wire bond () so that the conductive layer () is electrically coupled to the looped wire bond ().

Method of forming a semiconductor package and structure thereof

A lead frame () for a packaged electronic device having split flag structures () coupled by support structures (). The support structures include bend portions () for providing stress relief between the flag structures during the manufacture and/or during the operation of a packaged electronic device (). In one embodiment, the packaged electronic device includes an inertial sensor ().

Lead frame with flag support structure

Selective encapsulation of a micro electro-mechanical pressure sensor provides for protection of the wire bands ( ) through encapsulation while permitting the pressure sensor diaphragm ( ) to be exposed to ambient pressure without encumbrance or obstruction. Selective encapsulation is made possible by the construction of a protective dam ( ) around the outer perimeter of a pressure sensor diaphragm ( ) to form a wire bond cavity region between the protective dam ( ) and the device housing ( ). The wire bond cavity may be encapsulated with an encapsulation gel ( ) or by a vent cap ( ). Alternatively, the protective dam ( ) may be formed by a glass frit pattern ( ) bonding a cap wafer ( ) to a device wafer ( ) and then dicing the two-wafer combination into individual dies with protective dams attached.

Micro electro-mechanical system sensor with selective encapsulation and method therefor

A package for mounting electrical components and a method for making the package. A mold structure (50) is formed by encapsulating a portion of a leadframe (10) with a molding compound. Leads (23) project from one side of the mold structure and a portion of a tab (27) projects from another side of the mold structure, which has a cavity (57) between the leads (23) and the tab (27). In addition, the mold structure has vent holes (76) between the leads (23) and an aperture (62) extending to the cavity. After mounting a semiconductor chip (64) in the cavity (57), it is covered by a lid (53) and a portion (24) of the leads (23) and a portion (29) of the tab (27) are formed. The tab (27) provides structural rigidity to the mold structure (50) and permits surface mounting the mold structure (50).

Package for electrical components having a molded structure with a port

Growing community of inventors

Mesa, AZ, United States of America

Dave S Mahadevan