Avery Dennison Corporation

Dave N Edwards

Ali Reza Mehrabi

Jay Raghunandan Akhave

Mark Anthony Licon

Haochuan Wang

Kouroche Kian

Akiko Tanabe

Yukihiko Sasaki

Scott Wayne Ferguson

Peikang Liu

A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.

Method and apparatus for creating RFID devices

A device, such as a radio frequency identification (RFID) inlay structure for an RFID tag or label, includes a microstructure element, with leads coupling the microstructure element to other electrical or electronic components of the device. The leads may be electroless-plated leads, and may contact connectors of the microstructure element without the need for an intervening planarization layer.

Radio frequency identification device and method

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La Canada, CA, United States of America

Dave N Edwards