Hewlett Packard Enterprise Development LP

Hewlett-packard Development Company, L.p.

Dave Mayer

Arlen Lee Roesner

Karl Joseph Bois

Elene Chobanyan

Steven E Hanzlik

Paul Rubens

The present examples include a rack enclosure with perforations formed within vertical rack columns. Front vertical rack columns may include front perforations formed therein. The front perforations may draw air into the rack enclosure and further into a chassis. Side plenums along the side surface of the chassis may consume less space with the use of the front perforations. The space not consumed by the side plenums may be available to accommodate a chassis of a substantial volume. The chassis may expand a substantial width of the rack enclosure to house an enlarged or a maximum number of computing components within the rack enclosure.

Rack enclosure with perforations for cooling

Examples described herein include an electromagnetic interference shield. In some examples, the electromagnetic interference shield includes a wall comprised of a conductive material. The wall may have a first surface, a second surface, and a thickness between the first surface and the second surface. The shield may include a rounded opening in the wall that creates an air passageway through the thickness of the wall. The shield may also include a first obstruction in the opening and a second obstruction in the opening. The first obstruction may span across the opening. The second obstruction may span across the opening and intersect the first obstruction. The first obstruction and the second obstruction may be waveguide structures.

Waveguide structures

In the examples provided herein, an apparatus has modules to be cooled during operation, where each module is coupled to a heatsink, and the heatsinks are coupled to a first surface of a thermally conductive plate. The modules are positioned along a direction from a first side of the plate toward an opposite side of the plate. The apparatus also has heat pipes coupled to a second surface of the plate to transport heat away from the modules during operation, where the heat pipes are positioned nonuniformly along the direction.

Thermal management apparatus

An example device in accordance with an aspect of the present disclosure includes a housing to guide the device for attachment onto a computing system. A board is mounted in the housing and includes a first connector facing along a first direction. A hinge is to enable at least a portion of the board and the first connector to move along the first direction and engage a second connector for installation.

Housing and hinge to enable board movement

System and method for positioning a midplane within a computer chassis. In some embodiments, a computer system includes a chassis, a midplane disposed within the chassis, and a plunger pin coupled to the midplane. The plunger pin is selectably movable between a first position, wherein the midplane is immovable relative to the chassis, and a second position, wherein the midplane is moveable relative to the chassis.

System and method for positioning a midplane within a computer chassis

An airflow damper is provided, the airflow damper includes a resilient body having a fixed end and a free end. In a default state, the free end extends to restrict airflow. In a device accommodation state, the free end flattens to accommodate a device.

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Fort Collins, CO, United States of America

Dave Mayer