Viasat, Inc.

Dave Laidig

Kenneth V Buer

Michael R Lyons

Noel A Lopez

Friedhelm Wachter

A millimeter wave integrated waveguide interface package device may comprise: (1) a package comprising a printed wiring board (PWB) and a monolithic microwave integrate circuit (MMIC), wherein the MMIC is in communication with the PWB; and (2) a waveguide interface integrated with the package. The package may be adapted to operate at high frequency and high power, where high frequency includes frequencies greater than about 5 GHz, and high power includes power greater than about 0.5 W.

System and method for integrated waveguide packaging

A method and system for an integrated transceiver is presented. The integrated transceiver includes a transceiver housing, where a waveguide is formed inside the transceiver housing using a housing base and a sub-floor component. Neither the housing base nor the sub-floor component alone is configured to operate as a waveguide. In an exemplary embodiment, a portion of the waveguide is cast into the housing base and is part of the transceiver housing. Furthermore, in an exemplary embodiment, an antenna system includes a feed horn, a polarizer, the integrated transceiver, and a transceiver circuit that communicates with the waveguide to transmit and receive radio frequency signals. The integrated transceiver, in the exemplary embodiment, includes a transceiver housing base that forms a portion of an integrated waveguide assembly, and another portion of the integrated waveguide assembly aligns with the transceiver housing base to form the integrated waveguide assembly.

Integrated orthomode transducer

A millimeter wave system or package may include at least one printed wiring board (PWB), at least one integrated waveguide interface, and at least one monolithic microwave integrated circuit (MMIC). The package may be assembled in panel form incorporating parallel manufacturing techniques.

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Mesa, AZ, United States of America

Dave Laidig