Texas Instruments Corporation

Dat Tan Nguyen

Robert Milotta

Naweed Anjum

Thao To

David Maxwell

A system for scanning and analyzing a device wider test includes a transducer. The transducer transmits ultrasonic waves to scan the device under test and determine various properties (e.g., material of layers). The system further includes a heating/cooling portion. The heating/cooling portion conducts thermal stress testing on the device under test to accentuate areas of delamination between layers. The transducer then performs scans on the device under test to locate areas of delamination.

Scanning acoustic microscopy system and method

A system for scanning and analyzing a device under test includes a transducer. The transducer transmits ultrasonic waves to scan the device under test and determine various properties (e.g., material of layers). The system further includes a heating/cooling portion. The heating/cooling portion conducts thermal stress testing on the device under test to accentuate areas of delamination between layers. The transducer then performs scans on the device under test to locate areas of delamination.

An embodiment relates generally to a method of testing a mixed signal device. The method includes monitoring multiple parameters of the mixed signal device and scanning the mixed signal device with an optical source. The method also includes forming multiple windows, where each window is assigned to a respective parameter. The method further includes comparing an image from a respective image to a reference image to determine an existence of an anomaly.

Method, apparatus and system for detecting anomalies in mixed signal devices

According to one embodiment of the invention a method for determining the location of a potential defect in a device includes scanning a surface of the device with a temperature sensor while operating the device. The method also includes measuring a temperature of the device by a temperature sensor at a plurality of locations while scanning. Based upon the measured temperatures, a temperature profile is constructed for the device. The method also includes comparing the constructed temperature profile to a reference profile to determine a location of the potential defect in the device.

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Murphy, TX, United States of America

Dat Tan Nguyen