Seagate Technology Incorporated

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Andrew D Habermas

Joel William Hoehn

Zubair Ahmed Khan

Ricky Ray Anderson

Yuhong Xiong

Jeff O'Konski

Joshua Zierhut

Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.

Adhesive for processing a microelectronic substrate, and related methods

The present disclosure includes a lapping system that includes a temperature control system system to heat or cool the lapping plate while lapping. The temperature control system can include a closed circuit fluid system and/or one or more electrical resistive heating elements. In some embodiments that cooling system can control the temperature of the lapping plate during lapping to within +/&#x2212;5&#xb0; C., or even +/&#x2212;0.5&#xb0; C.

Lapping system that includes a lapping plate temperature control system, and related methods

Growing community of inventors

Savage, MN, United States of America

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