Texas Instruments Corporation

Daryl Ross Koehl

Buu Quoc Diep

Clayton Lee Stevenson

Jason C Green

Neal T Murphy

Claire Ching-Shan Jung

Donald J Rigsby, Jr

Braden Peter D'Andrea

A method and structure for uncovering captive devices in a bonded wafer assembly comprising a top wafer and a bottom wafer. One embodiment method includes forming a plurality of cuts in the top wafer and removing a segment of the top wafer defined by the plurality of cuts. The bottom wafer remains unsingulated after the removal of the segment.

Semiconductor device structures and their fabrication

Mems device and fabrication method

MEMS device and fabrication method

A system and method for the removal of superfluous material in a bonded wafer assembly. The method includes cutting a plurality of parallel cuts in a top wafer, the plurality of cuts defining a segment of the top wafer attached to another portion of the top wafer via a tab, inserting a wedge-shaped breaker bar into at least one cut of the plurality of cuts, applying force to the breaker bar to fracture the tab, and removing the segment of the top wafer from the bonded wafer assembly, wherein a bottom wafer remains unsingulated after the removing.

Bonded wafer assembly system and method

A system and method are disclosed including a vapor dryer chamber ( ) with a lid ( ). A heater ( ) is disposed within the vapor dryer chamber to vaporize liquid drying medium ( ), preferably isopropyl alcohol, in the bottom of the vapor dryer chamber ( ). Cooling coils ( ) disposed within an upper portion of the vapor drying chamber ( ) condense the drying medium vapor. A vapor monitor assembly ( ) is disposed within the vapor dryer chamber ( ) to monitor the vapor concentration within vapor dryer chamber ( ). A controller ( ) is associated with the vapor monitor assembly ( ) and evaluates vapor concentration measurements from the vapor monitor ( ).

System and method for controlling a vapor dryer process

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Garland, TX, United States of America

Daryl Ross Koehl