Freescale Semiconductor,inc.

Daryl R Wilde

Addi B Mistry

James H Kleffner

David Patten

Joseph M Haas

Brian H Christensen

John Rohde

John Gehman

Dennis O Kiffe

A stacked die system () has a first die () having a first surface with active circuitry, a second die () having a first surface with active circuitry, and a conductive shield () interposed between the first surface of the first die and the first surface of the second die. In one embodiment, the distance between the first surfaces of the first and second die is less than one millimeter. The stacked die system may also include a package substrate () where the active circuitry of the first and second die are electrically connected to the package substrate. The electrical connections may be formed using wire bonds (). Alternatively, the first die may be connected to the package substrate in a flip chip configuration. In one embodiment, the active circuitry of the first die generates RF signals where the shield helps protect the RF signals from interference caused by the active circuitry of the second die.

Digital and RF system and method therefor

A semiconductor package assembly has an intervening package ( ) that may be connected to a first package ( ) from a first substrate ( ) on a first side of the package ( ) and to a second package ( ) from a second substrate ( ) on a second, opposing side of the package ( ). Electrical contact to a semiconductor die ( ) is made from the first side by wire bonding to wire bond posts ( ) and by balls ( ) from the second side. Electrical contact from one side of the intervening package ( ) to the other may be made by bypassing the die. Electrical contact on either side of the intervening package may be made both within and outside the footprint of the semiconductor die ( ).

Semiconductor package with multiple sides having package contacts

Growing community of inventors

Cedar Park, TX, United States of America

Daryl R Wilde