Northrop Grumman Systems Corporation

Litton Systems, Inc.

Northrop Grumman Guidance and Electronics Company, Inc.

Daryl K Sakaida

Henry C Abbink

Robert E Stewart

Stanley F Wyse

Christine E Geosling

William P Debley

Michael D Bulatowicz

Howard H Ge

Gabriel M Kuhn

Robert C Griffith

Youngmin Albert Choi

Clifton T Council

Philip R Clark

Arnold E Goldman

Thomas G Council

John Thomson Douglass

Ike J Song

Ricardo J Rosete

Ming Li

John A Healey

Richard D Hatch

Embodiments of the invention include an accelerometer system. The system includes an accelerometer sensor comprising first and second electrode configurations and an inertial mass between the first and second electrode configurations. In one example, the accelerometer sensor being fabricated as symmetrically arranged about each of three orthogonal mid-planes. The system also includes an accelerometer controller configured to apply control signals to each of the first and second electrode configurations to provide respective forces to maintain the inertial mass at a null position between the first and second electrode configurations. The accelerometer controller can measure a first pickoff signal and a second pickoff signal associated with the respective first and second electrode configurations. The first and second pickoff signals can be indicative of a displacement of the inertial mass relative to the null position. The accelerometer controller can calculate an acceleration based on the first and second pickoff signals.

Accelerometer sensor system

An accelerometer system can include a sensor element comprising first and second proofmasses, the first proofmass accelerating in a first direction and the second proofmass accelerating in a second direction opposite the first direction in response to an external acceleration. A force rebalance controller applies control signals to at least one control element to provide a first force to accelerate the first proofmass toward a first null position and to at least one control element to provide a second force to accelerate the second proofmass toward a second null position. The force rebalance controller can also generate opposite polarity first and second output signals associated with respective displacements of the first and second proofmasses relative to the respective first and second null positions. An acceleration component calculates the external acceleration based on the first and second output signals.

Accelerometer systems and methods

A method for optimizing direct wafer bond line width for reduction of parasitic capacitance in a MEMS device by reducing the width of a bond line between a first and a second wafer, exposing the MEMS device to a water vapor for a predetermined time period and at a first temperature capable of evaporating water, cooling the MEMS device at a second temperature capable of freezing the water, and operating the MEMS device at a third temperature capable of freezing the water to determine if there is discontinuity during operation.

Method for determining leak rate through a bond line of a MEMS device

In one implementation, a chamber is selected that accommodates an array of die structures that comprises one or more cavities. An inner chamber of the chamber is maintained at a first temperature. An alkali metal source of the chamber is maintained at a second temperature greater than the first temperature. An outer chamber of the chamber is maintained at a third temperature greater than the first temperature and the second temperature. The one or more cavities of the array of die structures are filled with a portion of the alkali metal source. The one or more cavities of the array of die structures are sealed to comprise the portion of the alkali metal source.

Middle layer of die structure that comprises a cavity that holds an alkali metal

Method for optimizing direct wafer bond line width for reduction of parasitic capacitance in MEMS accelerometers

An apparatus in one example comprises a die structure that comprises a middle layer, a first outside layer, and a second outside layer. The middle layer comprises a cavity that holds an alkali metal, and one of the first outside layer and the second outside layer comprises a channel that leads to the cavity. The middle layer, the first outside layer, and the second outside layer comprise dies from one or more wafer substrates.

The fiber jacket application system is used to provide a protective jacket over spliced optical fibers (10, 12), such as to coat a length of bare fiber, previously coated fiber, and particularly to rejacket a length of fiber in which the jacket was removed for splicing. Curable jacketing material is twice fed from a reservoir (28) through a small orifice or syringe (32) onto the respective sides of bared portions (10d, 12d) of the fiber. A first material (14) is deposited from and between the existing jackets (10a, 12a) and onto essentially half of the bared portions. A second material (16) is deposited in bonded contact with the first applied material from and between the surrounding protective jackets and onto essentially the remaining half of the bared portions.

Optical fiber rejacketing method, apparatus and product obtained thereby

An input optical fiber (22), an output optical fiber (24, 26) and a waveguide (14) in an integrated optic chip (IOC) (12) intermediate the fibers are coupled together using service and alignment robots (42; 48, 50, 52). The service robot (42) establishes the three dimensional position of the waveguide. The alignment robots (48, 50, 52) three dimensionally and angularly align the input and output fibers respectively to the input and output legs (16; 18, 20) of the waveguide. An adhesive applying tool (46) coupled with the service robot adheres the input and output fibers respectively to their waveguide input and output legs. Included are specifics for an optical fiber clamp (110) capable of maintaining the orientation of a fiber while it is moved to another location, a vacuum holder (210) for holding and rotating an optical fiber for polarization purposes, goniometer mapping and positioning of an optical fiber with respect to the pivotal axis of the goniometer (324), initial light launching of an optical fiber to a waveguide using the fiber (422) in its cladding mode, planar and angular position alignment of optical fibers to optical waveguides, an alignment procedure for establishing a gap between waveguides, and attaching optical waveguides together.

System and method for aligning and attaching optical fibers to optical

An integrated accelerometer includes features for minimizing the effects of foreseeable operational stresses. The accelerometer is of a type that includes a planar support base having an internal aperture for accommodating a hinged strut and limit stops for minimizing the travel of the shadow paddle portion of the strut. The limit stops are fabricated of material of suitable spring constant to provide an appropriate degree of 'give' without degrading instrument performance or accuracy. Two-piece arrangements sandwich the hinges, thereby limiting flexure to an acceptable range. The predictable mechanical stresses resulting, for example, from thermal coefficient mismatches between the materials of the torquer coil and the strut are minimized by the use of a spacer intermediate the base and the coil. The spacer, fabricated of material whose thermal coefficient closely matches that of the pendulous mass is generally circular, and includes diametrically-opposed prongs on the upper and lower edges thereof, such arrangements of prongs being staggered by ninety degrees.

Integrated accelerometer with coil interface spacer

Integrated accelerometer with single hardstop geometry

Integrated accelerometer with resilient limit stops

Growing community of inventors

Simi Valley, CA, United States of America

Daryl K Sakaida