Intel Corporation

University of Nevada

Daryl James Nelson

Hong W Wong

Michael L Rutigliano

George H Daskalakis

Michael R Stark

Muralidhar Tirumala

Wah Yiu Kwong

Yoke Dou Chung

Duncan D MacGregor

Scott L Noble

Steve J Lofland

Mark Edward Thurston

Dhanesh Chandra

Anupam Kumar

Anjali Talekar

Lee Topic

Don J Nguyen

Shawn S Mceuen

Gerald A Budelman

Mark J Gallina

Kenzo Ishida

Steven Lofland

Lloyd L Pollard, Ii

Kevin J Daniel

James S Webb

Bill Lieska

Jeff Lauruhn

Peter O Butler

Ed H Kohlman

Eric J Salskov

Shinya Endo

Daniel Chiang

In some embodiments, cooling devices with metal hydrides are disclosed.

Method and apparatus for cooling devices using phase change materials

Mobile platforms and methods may provide for an integrated circuit such as a system on chip (SoC), a first heat spreader thermally coupled to the integrated circuit and a phase change material configuration thermally coupled to the first heat spreader. The integrated circuit may include logic to operate the integrated circuit in a performance burst mode according to a duty cycle, wherein the performance burst mode causes a phase change material to enter a liquid state within a graphite matrix of the phase change material configuration.

Thermal energy storage, dissipation and EMI suppression for integrated circuits using porous graphite sheets and phase change material

A keyboard is to be designed as a standardized keyboard having a certain length, width and thickness. The keyboard may be used interchangeably among different mobile computer systems. A keyboard cable associated with the keyboard may be designed such that it can accommodate an interface connector at any location relative to a bottom end of the keyboard. One or more control devices may also be used in conjunction with the keyboard. The control device may be designed with standardized dimensions, electrical interface, interface connector and cable length to enable it to accompany the keyboard among the different mobile computer systems.

Interchangeable keyboard for computer systems

According to one embodiment, a system is disclosed. The system includes a chassis including a printed circuit board (PCB) and a battery pack. The battery pack includes a connector to enable the battery pack to couple to a PCB which is mounted either above the centerline of the battery pack connector and on or below the centerline of the battery pack power connector.

Universal battery pack

A method and system are described for multi-stage cooling of a system, such as a computer system, and a high thermal dissipating object, such as a CPU, to minimize acoustic noise generated by the cooling system. The method includes causing at least one fan in a system to operate at high speeds during a first stage, and reducing the speed of at least one fan during an intermediary stage. The system includes a high thermal dissipating object, a heat sink connected to the high thermal dissipating object, a first fan to direct airflow on a main section of a heat sink during a first stage, and a second fan to direct airflow on an extended section of the heat sink. Optionally, a final stage may be entered into where all fans are shut off.

Multi-stage low noise integrated object and system cooling solution

According to one embodiment, a computer system is disclosed. The computer system includes a baseboard, a device bay including a fuel cell mounted on the baseboard, and a power pack coupled to the baseboard. The power pack includes a fuel cartridge that delivers fuel to the fuel cell.

Fuel cell power pack

A first aspect of the invention is an electrical connector that includes a housing formed to include first and second opposing ends and an elongated slot between the ends. The slot receives a connective edge of a printed circuit card. Closely spaced contacts located in the slot engage conductive pads on the printed circuit card. A first alignment member is formed integrally at the first end of the housing, to engage a non-polarized keyway during insertion of the printed circuit card into the elongated slot, aligning the printed circuit card relative to the contacts. A second aspect of the invention is the keying of the printed circuit card along a connective edge. The connective edge includes two connective regions which define a polarized keyway between the two connective regions. A third, non-connective, region located at one end of the connective regions defines a non-polarized keyway between the connective regions and the non-connective region. The polarized keyway is the dimensional datum point for fabrication of the printed circuit card and the non-polarized keyway is located precisely with reference to the polarized keyway. A third aspect of the invention is that different types of the printed circuit card, differentiated by the location of the polarized keyway, and the electrical connector form a system in which the connector may receive any of the types of the printed circuit card.

Method and apparatus for AGP universal connector

A method and apparatus for cooling components within a computer system chassis. In one embodiment, a cooling duct unit includes an air moving unit base with an air moving unit to draw and accelerate air from outside a computer system chassis to a high velocity airflow. Connected to the air moving unit base is a duct to converge and change the high velocity airflow from a circular shape to a noncircular shape. The converged and changed high velocity airflow is directed to cool a device within a computer system chassis. As a result, the device within the computer system is chassis cooled more uniformly and efficiently, while reducing acoustic noise and providing a modular cooling duct unit design for ease of attachment and removal.

Converging cooling duct for a computer cooling system

A retention mechanism for securing an electrical connector of a printed circuit card to an electrical connector of a main circuit board is presented. The retention mechanism has a base, through which each of the connectors fit, having a number of snaplets and a number of guiding ledges. The snaplets secure the retention mechanism to the electrical connector of the main circuit board, while the guiding ledges support the positioning of the electrical connector of the printed circuit card in the electrical connector of the main circuit board. A locking feature secures the electrical connector of the printed circuit card in place by fitting into a slot between a card arm and the main body of the printed circuit card. A handle extends from the locking feature, allowing for easy manipulation, so that the locking feature may be locked and unlocked and the printed circuit card may be inserted or removed at will.

Card retention mechanism

A heat dissipation device comprising a thermally conductive, hollow housing having a fan and an active anti-noise module disposed within the hollow housing. The hollow housing may include a plurality of fins disposed therein to increase the surface area for convective heat transfer. The heat dissipation device further may further include heat pipes for the transportation and dispersion of heat to and about an external surface of the hollow housing.

Silent heat exchanger and fan assembly

An electronic cartridge that includes a pair of spring clips which attach a thermal element to an integrated circuit or an integrated circuit package. The integrated circuit/package is mounted to a substrate. The substrate may be a printed circuit board. The cartridge may have a plurality of pins that extend from the thermal element and through the substrate. Each spring clip may have a pair of bent portions that are attached to the pins of the thermal element. The spring clip exerts a pull force that pulls the thermal element into the integrated circuit/package. The bent ports can be deflected so that at least a minimum pull force is always exerted onto the thermal element even with dimensional variations in the parts of the cartridge. The bent portions can therefore accommodate for tolerances in the cartridge while clamping the thermal element to the integrated circuit/package.

Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges

An apparatus and method for protecting the various components of a microprocessor is provided. The apparatus includes a thermal spreader cap that is disposed between the processor die and thermal plate, and the OLGA and thermal plate. Thermal grease layers are also provided between the thermal spreader cap and the thermal plate, the thermal spreader cap and the processor die, and the thermal spreader cap and the OLGA. The apparatus provides a compliant assembly that protects the processor die from damage due to shock and/or vibration. It also provides multiple thermal paths along which heat generated by the various components of the microprocessor may be removed, and therefore allows for a higher performance processor.

Thermal spreader cap and grease containment structure for semiconductor device

A modular cooling apparatus for computer systems is disclosed. The apparatus includes an air-guiding duct, a fan coupling to the duct and a coupling apparatus for coupling the air-guiding duct and the fan to an electronics housing. The air-guiding duct has an input opening to the exterior of the electronics housing and guides ambient outside air to the input of the fan. Then the fan directs this outside air to the inside of the electronics housing. The electronic housing can be formed between a base module and the computer system circuit board or between the air-guiding duct, fan and a retention module. Furthermore, outside air is delivered in a substantially perpendicular direction relative to the plane of the computer system circuit board within the electronics housing.

Fan duct module

An electronic cartridge which includes a cover. The cover is coupled to a substrate which has an integrated circuit package. A portion of the cover extends over and is spaced from a plurality of conductive pads located along an edge of the substrate. The conductive pads can be inserted into a card edge electrical connector that is mounted to a motherboard. The cover of the present invention protects the conductive pads while allowing the substrate to be plugged into a card edge connector.

Growing community of inventors

Beaverton, OR, United States of America

Daryl James Nelson