Artesyn Technologies, Inc.

Astec International Limited

Daryl E Weispfennig

Kwong Kei Chin

Bradley J Schumacher

Terry B Solberg

Bruce Arlen Frederick

Michael K Hennies

An integrated circuit assembly includes a first electrically conductive sheet, a second electrically conductive sheet electrically isolated from the first electrically conductive sheet, a non-conductive material disposed between the first and second electrically conductive sheets, an electrical trace disposed on the non-conductive material and electrically isolated from the first and second electrically conductive sheets, and an integrated circuit having at least one lead directly connected to the first electrically conductive sheet, at least one lead directly connected to the second electrically conductive sheet, and at least one lead electrically connected to the electrical trace. Other integrated circuit assemblies and method for making integrated circuit assemblies are also disclosed.

Assemblies and methods for directly connecting integrated circuits to electrically conductive sheets

An ORing element for use in a power supply and/or power system. The ORing element may include a field effect transistor (FET), a first bi-polar transistor and a second bi-polar transistor. The FET may be electrically connected between an input and an output. The first bipolar transistor may have an emitter electrically connected to the source of the FET and a collector electrically connected to a gate of the FET. The second bi-polar transistor may be diode connected, with its emitter electrically connected to its base. The emitter of the second bi-polar transistor may also be electrically connected to the base of the first bi-polar transistor. The collector of the second bi-polar transistor may be electrically connected to the drain of the FET.

Controller for ORing field effect transistor

A method and apparatus for dissipating heat from an electrical component. The method includes providing a planar element including a first electrically and thermally conductive region and a second electrically and thermally conductive region, such that the first and second regions define a spacing therebetween, and wherein the planar element includes at least one mechanically stabilizing tie connected between the first and second regions across the spacing, directly connecting a first terminal of an electrical component to the first region, directly connecting a second terminal of the electrical component to the second regions, such that the electrical component bridges the spacing, and removing the at least one mechanically stabilizing tie from between the first and second regions.

Growing community of inventors

Chanhassen, MN, United States of America

Daryl E Weispfennig