Intel Corporation

Daryl A Sato

David W Boggs

John H Dungan

Gary A Brist

Gary Baxter Long

Carolyn R McCormick

Rebecca A Jessep

Dan Willis

Frank A Sanders

Gary Paek

An apparatus that includes a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes.

Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery

Method of power-ground plane partitioning to utilize channel/trenches

A device includes a plane metallization layer, and a plane plated through hole attached to the plane metallization layer and terminating at the at a major exterior surface with a plurality of component mounting pads. The plated through hole is attached to the plane metallization layer. The plane plated through hole is electrically isolated from the plurality of component mounting pads at the exterior surface. A method for testing the device includes contacting the signal carrying through hole, and contacting the plane through hole, and checking for current flow between the signal carrying through hole and the plane through hole. If current flows between the signal carrying through hole and the plane through hole the device fails. If no current flows between the signal carrying through hole and the plane through hole the device passes.

Apparatus for providing an integrated printed circuit board registration coupon

Formation of a plurality of conductive connectors of an integrated circuit package is described. The conductive connectors made with a conductive elastomer material and formed using an interposer that includes a plurality of the conductive connectors linked together.

Electronic packaging using conductive interproser connector

A generally planar interposer having a plurality of interposer contact pads to contact a plurality of first contacts of a first electronic device on one side of the interposer, and a plurality of electrical connections between the interposer contact pads and a plurality of pressure contacts on the other side of the interposer. Each of the pressure contacts having a directionally deformable contact surface to removably contact a plurality of second contacts of a second electronic device on the other side of the interposer. Also methods of forming the interposer.

Three-dimensional flexible interposer

A method for forming a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes.

Method for creating power-ground plane partitioning and via connection to utilize channel/trenches for power delivery

Electronic packaging using conductive interposer connector

A method for providing an improved solder joint for a via-in-pad ball grid array package. One or more bonding pads are formed upon a substrate. One or more vias are formed through the substrate within the bonding pad. The vias are plugged with a via plug material. The via plug material is then preconditioned such that an amount of volatiles within the via plug material is reduced.

Preconditioning via plug material for a via-in-pad ball grid array package

Formation of a mixed-material composition through diffusion using photo-thermal energy. The diffusion may be used to create electrically conductive traces. The diffusion may take place between material layers on one of a package substrate, semiconductor substrate, substrate for a printed circuit board (PCB), or other multi-layered substrate. The photo-thermal energy may be supplied by various devices, for example a YAG laser device, COlaser device, or other energy source.

Photo-thermal induced diffusion

An electronic assembly is disclosed. The electronic assembly includes a lower portion and a first elongate trace formed on an upper surface of the lower portion. The trace is covered by an upper portion, and an opening formed through an upper surface of the upper portion extends to the trace to expose a portion of the trace. A second elongate trace is formed on the upper portion. A portion of the second elongate trace positioned in the opening formed through the upper surface of the upper portion contacts the first elongate trace through the opening to form an electrical interconnection between the first trace and the second trace.

PCB method and apparatus for producing landless interconnects

Formation of a mixed-material composition through diffusion using photo-thermal energy. The diffusion may be used to create electrically conductive traces. The diffusion may take place between material layers on one of a package substrate, semiconductor substrate, substrate for a printed circuit board (PCB), or other multilayered substrate. The photo-thermal energy may be supplied by various devices, for example a YAG laser device, COlaser device, or other energy source.

An arrangement of pads with selective via in pad for mounting a semiconductor package on a substrate. In order to strengthen the soldered bonds, standard pads, which have a stronger bond, are used in locations of greatest stress and deflection. Vias in pad (VIP) are used at all other locations to improve routing advantages due to their smaller surface area.

Arrangement of vias in a substrate to support a ball grid array

A printed circuit board and a system and method of embedding conductor channels into a printed circuit board. These conductor channels are used to provided increased power to circuits on the printed circuit board, provide shielding for these circuits and provide communications for these circuits. These conductor channels are created by ablating dielectric layers in the printed circuit board and depositing a conductive material therein.

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Beaverton, OR, United States of America

Daryl A Sato