Emc Corporation

Darrin Haug

Steven D Sardella

Robert P Wierzbicki

Ralph C Frangioso, Jr

Paul H Maier, Jr

Matthew J Borsini

Brandon Barney

Brian K Bailey

Thomas J Connor

Andrew P Kubicki

Joseph B Shimkus

Joseph Perry

Keith A P Morrissette

An improved redundant computing apparatus includes a chassis assembly configured to (i) mount to a standard electronic equipment rack and (ii) consume substantially 1U of space in a particular direction (e.g., vertical height) within the standard electronic equipment rack. The chassis assembly includes a housing and a midplane disposed within the housing. The apparatus further includes a set of power supply/blower assemblies configured to connect to the midplane of the chassis assembly through a front of the housing in a field replaceable manner, and a set of computing devices configured to connect to the midplane of the chassis assembly through a back of the housing in a field replaceable manner. By way of example, the set of computing devices is adapted to move data into and out of a set of disk drives on behalf of a set of external host computers.

Techniques for redundant computing within a 1U form factor with improved resource partitioning and management

In a system comprising a plurality of components, characteristic data is stored on programmable read-only-memories (PROMS) on each component. The PROMs are coupled together via a simple bus, and data is retrieved from the PROMs using the bus. The collection of data from the PROMs provides the component characteristic data, and a portion of the component characteristic data is stored in one or more persistent media devices in the system, creating a last known good copy. The persistent storage device could be any device that does not lose data in the event of a loss of power.

Method and apparatus for preserving data in a high-availability system preserving device characteristic data

A circuit board has a first signal layer having a set of conductors, a second signal layer having a conductive plane and a non-conductive region, and a third signal layer having a conductive region that mirrors the non-conductive region of the second signal layer. The circuit board further includes a first separating layer having non-conductive material which is disposed between the first signal layer and the second signal layer, and a second separating layer having non-conductive material which is disposed between the second signal layer and the third signal layer. Accordingly, traces within the first signal layer and overlying the conductive plane of the second signal layer will have a first impedance, while traces within the first signal layer and overlying the non-conductive region of the second signal layer and the conductive region of the third signal layer will have a second impedance that is different than the first impedance.

Techniques for making a circuit board with improved impedance characteristics

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Bellingham, MA, United States of America

Darrin Haug