International Business Machines Corporation

Western Digital Technologies, Inc.

Hgst Netherlands, B.v.

Hitachi Global Storage Technologies Netherlands B.v.

Sandisk Technologies Inc.

Darrick Taylor Smith

Glenn Paul Gee

David John Seagle

Hicham Moulay Sougrati

David Patrick Druist

Steven Harry Voss

Damaris Davis

Carl Robert Mendel

Teodosio B Quilapquilap, Jr

Sharon C Agtina

Anthony M Bagus

Dennis James Veerkamp

John Thomas Contreras

Edward Hin Pong Lee

Ferdinand Hendriks

Edward Kihyen Lee

Xiao Z Wu

Jih-Shiuan Luo

Diane L Brown

Ian Robson McFadyen

Timothy Scott Hughbanks

Scott Arthur Thomas

Edward H P Lee

Jeffrey P Gunder

Unal Murat Guruz

John P Herber

Ali Sanayei

Glen P Gee

Edward H Lee

Edward Kou-Wei King

A high density slider clamp fixture is disclosed for accurately positioning a large number of head sliders for metrology testing. The slider clamp fixture may include a single piece, monolithic structure comprising a large number of slider nests, aligned in rows and columns in the slider fixture. Each slider nest includes a reference datum surface machined to precisely align with all other reference datum surfaces in a row of the monolithic structure. Each slider nest further includes a flexure clamp for independent clamping of each slider in the row against the reference datum surfaces.

Method of making a high density slider clamp fixture

A lapping mount tool and a process for lapping a row of head sliders involves affixing the row to a lapping mount tool fixture, actuating each of multiple first actuation pins to set each head slider for lapping to a respective element target stripe height, and simultaneously lapping accordingly. The process may further involve actuating each of multiple second actuation pins to set each head slider for lapping to a respective target wedge angle, and simultaneously lapping accordingly. Each target wedge angle may be achieved by applying a respective angular force to a compliant elastomer adhered to the fixture and to the row, where such angular forces may be applied through at least two flexures interconnecting a rotatable first structural member and a second structural member of the lapping mount tool, wherein the flexures virtually intersect at and define an axis of rotation about which the angular forces are applied.

Within-row stripe height and wedge angle control for magnetic recording read-write heads

A lapping tool assembly includes a mount tool and an interposer structure interposed between actuators and the mount tool, where the interposer includes interposer pins reactively coupled with the actuators such that each interposer pin is configured to receive a translational force from a corresponding actuator and to transmit the force to a corresponding actuation pin of the mount tool. The interposer may include a zero z-axis shift flexure system, and/or a z-axis decoupling flexure system, and/or alignment features, for accurately transmitting the actuation forces to the mount tool, while inhibiting affecting other portions of the mount tool.

Actuator tilt interposer for within-row lapping mount tool for magnetic recording read-write heads

High density slider clamp fixture

A process for lapping a row of head sliders involves fixing the row to a lapping tool fixture, actuating each of multiple force pins to set each head slider for lapping to a respective target wedge angle, and simultaneously lapping accordingly. Each target wedge angle may be achieved by applying a respective torque to a compliant elastomer between each force pin and corresponding head slider, to transfer a pressure gradient corresponding to the torque to the corresponding head slider. Such torques may be applied through at least two wedge angle flexures interconnecting a rotatable box structure and a fixed back wall of a lapping tool, wherein the flexures virtually intersect at and define an axis of rotation about which the torques are applied. The process may further involve actuating each force pin to set each head slider for lapping to a respective reader target stripe height, and simultaneously lapping accordingly.

Within-row wedge angle control for magnetic recording read-write heads

A process for manufacturing a magnetic tape head module involves depositing over a wafer substrate electrical traces from respective electrical lapping guides (ELGs) to an area at an end of a tape head module also formed over the substrate, fabricating a closure adjacent to the tape head module where the closure terminates outside of the area at the end of the tape head module, and electrically connecting the electrical traces to an external circuit using a wire-bonding procedure, thereby electrically connecting each ELG to the external circuit. A plurality of electrical connection pads may be deposited at the area at the end of the tape head module, and each electrical trace electrically connected to one of the pads, where electrically connecting the traces to the external circuit includes wire-bonding the pads to the circuit.

Wire bonding electrical lapping guides for tape head module

Embodiments described herein generally relate to resistive shunt design in a read sensor for providing accurate measurements from an electronic lapping guide (ELG). More specifically, embodiments described herein relate to a transducer resistor shunt structure for low cost probing. A bleed resistor network for a read sensor may comprise one or more first resistors arranged in parallel with one another and a second resistor arranged in series with the one or more first resistors. The resistor arrangement may require a small physical area and reduce or prevent ELG measurement errors.

Transducer resistor shunt structure for low-cost probing

Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller such that the number of wire bonds from the controller to a row of read heads is minimized. When lapping the air bearing surface of the read heads, the electrical resistances of the ELGs are monitored to adjust the lapping process and set the stripe height for read sensors in the read heads. Once the resistance corresponds to the desired stripe height, the lapping process is stopped. To measure the resistance, each ELG may be electrically coupled to the same substrate&#x2014;i.e., share the same common ground. The lapping controller applies a voltage potential across the ELGs using a wire bonded to a pad in the respective read head and one or more connections to the grounded substrate. This configuration avoids having to bond two wires onto each read head.

Common ground for electronic lapping guides

Embodiments described herein generally relate to connecting electronic lapping guides (ELGs) to a lapping controller to prevent the effects of current crowding while reducing connections to the ELGs in single pad lapping. Devices and systems can include a row of sliders including a magnetoresistive (MR) element, a plurality of high resistance ELGs connected to both the wafer and to at least one bonding pad and at least two peripheral grounding vias connected to the wafer. Methods and systems include a wafer comprising a plurality of sliders wherein each slider is connected to a lapping controller and the delivery of current to the ELGs is sequential to groups of sliders such that only one group of ELGs is being measured at any time.

Correcting current crowding in row bar and vias for single pad bonding

Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller to reduce resistance from current crowding while reducing connections to the ELG. A device and a system can include a wafer with peripheral grounding vias having a radius of at least 10 &#x3bc;m, a plurality of sliders with a magnetoresistive (MR) elements; a plurality of ELG electrically coupled to the lapping controller through a combination of the wafer and grounding pads and a bonding pad electrically coupled to the ELG. The ELG or the bonding pad can be positioned in the kerf or the device region of a row. If the ELG and the bonding pad are positioned in separate regions, a noble metal should be used to connect. Further, the number of grounding pads can be reduced by using grounding vias at specific intervals and specific sizes.

Wafer grounding design for single pad lapping

A station for performing a lapping method to achieve tight dimension controls for both read and write elements of magnetic recording heads is disclosed. A recording head having a read head stripe height and a write head throat height is lapped using a plurality of lapping forces. At least one of the plurality of lapping forces includes a torque force. A lapping wedge angle is controlled using at least one torque force, which controls the offset between the recording head read head stripe height and the write head throat height.

Lapping method and station to achieve tight dimension controls for both read and write elements of magnetic recording heads and magnetic storage device formed thereby

A slider lapping texture for implementation in a lapping environment. The slider lapping texture includes a lapping texture structure for utilization in a lapping process performed on a slider. The structure also includes a first surface having a base elevation. The structure further includes a second surface at an elevation higher than the base elevation. The second surface is for lapping the slider. The structure additionally includes an opening for expelling residue associated with a lapping process. The slider lapping texture is configured to generate an attractive force when the slider is motioned thereupon in a substantially unidirectional manner.

Lapping plate texture for increased control over actual lapping force

A device for handling and testing individual sliders in a row-like format utilizes an elongated, row-like holder having a series of small pockets, each of which receives a single slider. After the sliders enter the holder, a clamp is moved to a closed position to retain the sliders in the holder. The holder is placed in a test fixture such that permanently mounted probes precisely engage the small pads on the sliders for multiple testing purposes. Enlarged probe pads on the test fixture are electrically interconnected with the probes to provide an operator with easy access to the slider pads. The sliders are tested in a row-like format, side by side, to reduce handling-induced electrostatic discharge and mechanical damage.

System, method, and apparatus for handling and testing individual sliders in a row-like format in single slider processing systems

A tool block holds an integrated lead suspension during assembly. The tool block has a number of features for precisely positioning the integrated lead suspension while transducer heads are being mechanically and electrically connected to it. The most critical feature is a movable datum clamping pin which is positioned to precisely engage a mount plate on the integrated lead suspension. Other features of the tool block include a platform support, a locating hole, a platform clamp and a pivot arm.

Method for processing an integrated lead suspension

A pallet accelerator transfers workpiece pallets at high speeds from a pre-stop to a work stop in a conveyorized manufacturing line. While a workpiece is being processed in the work stop position, a pallet is released from a release stop into the pallet accelerator at the pre-stop position. The pallet accelerator has two fingers which engage the pallet. The pallet accelerator is pneumatically actuated to accelerate the pre-stop pallet forward while simultaneously pushing the work stop pallet downstream out of the work stop. The pallet accelerator resets for the next pallet released from the release stop while the pallet at the work stop is processed.

Growing community of inventors

San Jose, CA, United States of America

Darrick Taylor Smith