Ppg Industries Ohio, Inc.

Si-cal Technologies, Inc., a Nissha Company

Darren Burn

Gregory J McCollum

Paul F Cheetham

Jaye Tyler

Methods of transferring an electrically conductive material to a substrate are disclosed. The methods include: a) contacting at least a portion of the substrate with an electrically conductive material disposed on a carrier film; and b) applying heat and pressure to the substrate and carrier film for a period of time ranging from 1 to 40 seconds, at a temperature ranging from 200&#xb0; F. to 450&#xb0; F., and at a pressure ranging from 30 to 150 psi, such that the electrically conductive material adheres to the substrate. Methods of forming a layered structure are also disclosed.

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Enfield, CT, United States of America

Darren Burn