Dell Products Inc.

Darren Burke Pav

Corey Dean Hartman

Michael Dennis Marcade

Jake Hill Lavallo

David McKinney

Damon W Broder

David J Hernandez

Juan Manuel Gonzalez

Wesley Brook Morgan

Lisa Maria Sura

Richard Worley

James Trevor Goulding

Richard Eddings

Andrea Falkin

Troy Bryant

A fan tray system includes a fan tray base that couples to a chassis and that includes fan system connector(s) for connecting to a fan system. A fan tray side wall includes fan system guide member(s) that align the fan system for connection to the fan system connector(s), and is connected to the fan tray base by a moveable coupling that allows relative movement between the fan tray side wall and the fan tray base. That relative movement allows the fan tray side wall to be positioned in a first orientation when the fan tray base is coupled to the chassis such that the fan tray side wall is positioned adjacent a chassis wall of the chassis and impedes access component(s) in the chassis. That relative movement also allows the fan tray side wall to be moved to a second orientation that allows access to the component(s) in the chassis.

Fan tray system

A cable retention subsystem includes a frame member and at least one board coupling member that is located on the frame member and couples the frame member to a board. A frame alignment member is located on the frame member and aligns a cable connector included on a cable subsystem with a board connector included on the board when the frame alignment member is engaged with a cable alignment member included on the cable connector. The cable retention subsystem also includes at least one frame retention member located on the frame member that engages with the cable connector when the cable connector is coupled with the board connector, and resists movement of the cable connector in a direction that is substantially perpendicular to the board.

Cable retention system

An expansion planar system includes an expansion planar mounted to an expansion planar chassis and including expansion component(s) coupled to a system connector. A coupling subsystem mounted to the expansion planar chassis couples to a system chassis that includes a main planar and an expansion connector. While coupled to the system chassis, the coupling subsystem may provide the expansion planar chassis in a first orientation in which the system connector engages the expansion connector and the expansion planar chassis impedes access to component(s) on the main planar. While coupled to the system chassis, the coupling subsystem may also provide for rotation of the expansion planar chassis relative to the main planar to disengage the system connector from the expansion connector and provide the expansion planar chassis in a second orientation in which access to the component(s) on the main planar is no longer impeded by the expansion planar chassis.

Expansion planar coupling system

A structural subassembly for use in an information handling system chassis may include a first portion, a second portion, a common wall, and one or more mechanical features. The first portion may be configured to receive one or more of a first type of information handling resource. The second portion may be configured to receive one or more of a second type of information handling resource. The common wall may divide the first portion from the second portion. The one or more mechanical features may be configured to engage with one or more respective mechanical features of the information handling system chassis in order to perform at least one of guiding of the subassembly relative to the information handling system chassis during insertion or removal of the subassembly into or from the information handling system chassis and retention of the subassembly relative to the information handling system chassis.

Structural subassembly for use in an information handling system chassis

In accordance with these and other embodiments of the present disclosure, a system may include a top plate, a bottom plate mechanically coupled to the top plate; a plurality of first connectors and a second connector. The plurality of first connectors may be located on an exterior surface of the top plate such that each of the plurality of first connectors is configured to electrically couple to a corresponding connector of an information handling resource as the information handling resource is mechanically supported by the top plate. The second connector may be electrically coupled to each of the plurality of first connectors and may be located on an exterior surface of the bottom plate such that the second connector is configured to electrically couple to a circuit board.

Mezzanine-style structure with integrated wiring harness

Cooling airflow through an information handling system is redirected at positions of a motherboard having an unpopulated processing component towards positions of the motherboard having processing components. For example, a shroud shaped as a nozzle couples to a heat sink connector of the motherboard to cover an unpopulated CPU socket. The shroud has a nozzle-shaped channel with an inlet accepting cooling airflow and an outlet exhausting the cooling airflow towards a processing component. For instance, the inlet is proximate a cooling fan and the outlet directs the airflow from the cooling fan towards a heat sink associated with RAM populated on the motherboard.

System and method for managing cooling airflow for a multiprocessor information handling system

Cooling airflow through an information handling system is redirected at positions of a motherboard having an unpopulated processing component towards positions of the motherboard having processing component. For example, a shroud shaped as a nozzle couples to a heat sink connector of the motherboard to cover an unpopulated CPU socket. The shroud has a nozzle-shaped channel with an inlet accepting cooling airflow and an outlet exhausting the cooling airflow towards a processing component. For instance, the inlet is proximate a cooling fan and the outlet directs the airflow from the cooling fan towards a heat sink associated with RAM populated on the motherboard.

A multiple component mounting system includes a first carrier including a base. A plurality of first component coupling members are located on the base and define a first component channel. At least one of the first component coupling members include a first resilient member that is operable to engage a first component when the first component is located in the first component channel in order to secure the first component to the base free of the use of a tool. A plurality of second component coupling members are located on the base and define a second component channel. At least one of the second component coupling members include a second resilient member that is operable to engage a second component when the second component is located in the second component channel in order to secure the second component to the base free of the use of a tool. A plurality of second carrier coupling members are located on the base and operable to secure the base to a second carrier that may then be mounted to an information handling system chassis.

Multiple component mounting system

An air directing apparatus includes a first air directing member defining a component access passageway. A second air directing member is moveably coupled to the first air directing member, whereby the second air directing member is moveable relative to the first air directing member into a first position and a second position, wherein with the second air directing member in the first position the component access passageway is substantially obstructed and with the second air directing member in the second position the component access passageway is substantially unobstructed.

Directing air in a chassis

A heat sink retention apparatus includes a base member and a heat sink mount including a pivotal base coupler and a board mounting member, whereby the heat sink mount is operable to mount to a board by engaging the pivotal base coupler with the base member and engaging the board mounting member with the board. A cable routing member and a connector storage member may be included on the heat sink mount for the routing of cables and the storing of connectors. A card retention device may be provided which is operable to couple to the heat sink mount and engage a card to retain the card on the board.

Method and apparatus for heat sink and card retention

A board mounting apparatus includes a chassis and a chassis base member positioned in the chassis, the chassis base member defining a channel and an open volume adjacent the channel. A first portion of the channel comprises a first width. A second portion of the channel has a second width greater than the first width. The second portion is operable to accept a sliding connector, and the first portion is operable to secure at least a portion of both a fixed and sliding connector.

Method and apparatus for board mounting in a chassis

A chassis bushing assembly is provided. The chassis bushing assembly includes an outer disc and an inner disc. The outer disc includes a lip and has first face and a second face. The inner disc includes a shoulder and has a third face and a fourth face. In addition, the inner disc coaxially mates with the outer disc. The chassis bushing assembly further includes a first aperture extending through the first and second faces of the outer disc and a second aperture, coaxially located with respect to the first aperture, extending through the third and fourth faces of the inner disc. The chassis bushing assembly is symmetrical so that each chassis bushing location within a chassis utilizes the same chassis bushing assembly. In addition, the chassis bushing assembly is common across different chassis types and backwards compatibly with previous chassis designs.

Growing community of inventors

Round Rock, TX, United States of America

Darren Burke Pav