Dell USA L P

Dell Products Inc.

Darrell J Slupek

Sandor Tibor Farkas

Indrani Paul

Bhavesh Govindbhai Patel

Victor K Pecone

N Deepak Swamy

Aubrey K Sparkman

Gita P Khadem

Hector F Martinez

Larry P Robison, Jr

Becky Dugan

Becky J Clowers

A test coupon on a printed circuit board used for verifying that vias in the printed circuit board are back drilled to a proper predetermined depth. Use of the coupon involves correlating a via on the board to a via of a test coupon drilling the board via and the test coupon via to substantially the same depth, where the depth is predetermined based on the board via. Then measuring the impedance of the test coupon to reveal the actual depth of the back drilling of the coupon via. Knowing the actual back drill depth of the coupon via is used to verify the back drill depth of the board via.

Method of processing a circuit board

A surface mount pad and a component to be soldered onto the pad includes a main portion and two extension portions coupled to the main portion. The surface mount pad has an indentation which is defined by the extension portions. The portions extend from the main portion on opposing sides of the indentation. The extension portions are positioned to extend from underneath the component lead. The indentation extends underneath the component lead.

Pad with indentations surface mount

The present application describes a through-hole component insulator and assembly process which has the advantages of preventing solder from contacting the metal case of a through-hole component without an addition step or additional material from the standard fabrication process for a printed circuit board. The printed circuit board of the present invention includes a printed ink spacer disposed beneath the through-hole component wherein the printed ink spacer is included with a standard silk-screen artwork layer in the printed circuit board design stage. The printed ink spacer raises the through-hole component from the printed circuit board surface to prevent solder from contacting the metal case of the through-hole component during the printed circuit board soldering stage. Using a silk-screen artwork layer which includes at least one printed ink spacer in the artwork, the printed ink spacer is deposited during deposition of a standard printed design on the printed circuit board fabrication.

Printed circuit board manufacturing method for through hole components

A printed circuit board includes a multi-component mounting footprint for mounting one of several possible differently sized discrete component packages on the circuit board. The multi-component mounting footprint includes a first mounting pad which has two connection points for mounting a connector on one of two different sized components. The footprint also includes a second mounting pad which is symmetric to the first mounting pad. About the mounting pads are cut outs which prevent solder buildup when either one of two different sized components are mounted thereon.

Apparatus for multi-component PCB mounting

A circuit board is provided having a plurality of vias and uniformly spaced connector stubs arranged upon one or both outer surfaces of the control board. Sets of trace conductors are formed within the control board between the vias. The trace conductors are arranged in two planes within the control board, wherein trace conductors within one plane are laterally offset from trace conductors in the other plane. Laterally offset trace conductors allow close spacing of the trace conductor planes while maximizing the spacing between trace conductors and corresponding reference conductors also placed within the control board. Additionally, the trace conductors are serpentine-shaped when viewed from a perspective perpendicular to the planar surface of the control board. The serpentine shape, in conjunction with carefully controlled spacing between planes of trace conductors as well as between the trace conductor planes and reference conductors, provides high impedance trace conductors in a limited space area necessary to meet SCSI specifications.

Growing community of inventors

Austin, TX, United States of America

Darrell J Slupek