Delphi Technologies, Inc.

Delco Electronics Corporation

Darrel Eugene Peugh

Bruce Alan Myers

Thomas Alan Degenkolb

Henry M Sanftleben

Gary Eugene Oberlin

Wayne Anthony Sozansky

Scott David Brandenburg

Carl William Berlin

Shih-Chia Chang

Erich William Gerbsch

Matthew R Walsh

M Ray Fairchild

Lester Wilkinson

James M Rosson

Susan Acheson Mack

Michael Ray Witty

Michael Patrick Meehan

Michael D Gibson

Robin L Sellers

Joanna Christine Berndt

Douglas E Gullion

Stuart E Longgood

An electronic assembly is provided having a thermal cooling fluid, such as a liquid, for cooling an electronic device within a sealed compartment. The assembly includes a housing generally defining a sealed fluid compartment, an electronic device disposed within the housing and a cooling liquid for cooling the electronic device. The assembly includes inlet and outlet ports in fluid communication with the sealed fluid compartment for allowing the cooling liquid to pass through the compartment to cool the electronic device. Fluid flow channels are formed in thermal communication with the electronic device within the housing. The fluid channels include channels that allow liquid to flow in thermal communication with the electronic device to cool the device.

Fluid cooled electronic assembly

A power semiconductor device package utilizes integral fluid conducting micro-channels, one or more inlet ports for supplying liquid coolant to the micro-channels, and one or more outlet ports for exhausting coolant that has passed through the micro-channels. The semiconductor device is mounted on a single or multi-layer circuit board having electrical and fluid interconnect features that mate with the electrical terminals and inlet and outlet ports of the device to define a self-contained and self-sealed micro-channel heat exchanger.

Power semiconductor package having integral fluid cooling

A fluid-cooled electronic assembly including a base having a fluid inlet and a fluid outlet therein, a cap attached to the base to form a fluid containment chamber therebetween, wherein the fluid containment chamber is in fluid communication with the fluid inlet and the fluid outlet, and an electronic device disposed within the fluid containment chamber and connected to the base, the electronic device having a plurality of microchannels adapted to receive a cooling fluid flow therethrough, wherein the cap is shaped to direct a fluid flow from the fluid inlet to the microchannels such that a pressure drop between the fluid inlet and the fluid outlet is reduced.

Fluid-cooled electronic system

The present invention provides a method for producing an electronic assembly and an electronic assembly with an integrated cooling system for dissipating heat. The electronic assembly comprises a base; and at least one electrical component attached to the base. The base defines an integrated cooling system having a fluid channel spanning within the base and at least one heat exchanger in heat communication with the fluid channel. The integrated cooling system may further include a pump attached to the base for directing the flow of the fluid within the fluid channel, and a port in fluid communication with the fluid channel for receiving fluid from an external source.

Integrated cooling system for electronic devices

The present invention relates to an apparatus and method for dissipating heat from high-power electronic devices. The assembly includes a high-current substrate, such as a printed circuit board supporting an electronic device, a heat pipe thermally coupled with the electronic device and an assembly case which also forms a heat sink, and thermal transient suppression material which may be thermally coupled with the electronic device and the heat pipe.

Power electronic system with passive cooling

A package and packaging method that incorporates multiple surface-mounted devices mounted to the package, which in turn can be mounted onto a circuit board. The package generally includes a pair of laminate substrates that together form a chip carrier and input/output (I/O) interface structure for the devices. The devices are mounted to opposite surface of a first of the substrates. The second substrate is attached to the first substrate, and has an interior opening therethrough. The first and second substrates are attached to each other such that devices mounted on one surface of the first substrate are disposed within the interior opening of the second laminate substrate. A mold compound can be applied to underfill and encapsulate the devices mounted to the surfaces of the first substrate.

Mutli-chip module

A corrosive resistant electronics assembly is provided including at least one heat generating electronics component mounted on a substrate and positioned within potting material . A thermally conductive block element is thermally mounted to the at least one heat generating electronics component and positioned within the potting material , thereby providing a corrosive resistant electronics assembly with improved thermal dissipation.

Corrosive resistant flip chip thermal management structure

A combination circuit board ( ) and segmented bus structure ( ) defines a composite circuit board/bus assembly ( ) upon which an electrical circuit may be assembled. The various segments ( ) of bus structure ( ) may be variously configured to achieve one or more assembly, performance, testing, and/or reliability goals. For example, one bus segment configuration provides integral connector tabs ( and ) for mechanical and/or electrical connection to interconnecting wires or electrical terminals of one or more external devices. Another bus segment configuration ( ) provides for mechanical and high current electrical interconnections between one or more bus segments ( ) and one or more electrical components ( ) and/or conductive film patterns( ) formed on top surface ( ) of the circuit board ( ). Still another bus segment configuration provides integral tabs ( and ) for electrical connection to and mechanical attachment of electrical components ( ) from one or more of such tabs ( and ) extending through the circuit board ( ) to other such tabs ( and ) or other circuit structures. Yet another bus structure ( ) provides for highly efficient heat sinking capability and/or electrical connection for electrical components ( ) mounted either directly to one or more bus segments ( ) and for electrical components ( ) mounted to a substrate ( ) that is itself mounted directly to one or more bus segments ( ).

Combination circuit board and segmented conductive bus substrate

A circuit structure and method for conducting heat from a power flip chip. Heat is dissipated from a flip chip mounted to a PCB by conducting heat through conductive vias to the opposite surface of the PCB. The flip chip is equipped with two sets of solder bumps, one of which is registered with conductors on the PCB, while the second is registered with a thermal conductor layer on the PCB surface and electrically isolated from the conductors. A second thermal conductor layer on the opposite surface of the PCB contacts the vials, such that heat is conducted from the flip chip to the second thermal conductor layer through the second set of solder bumps, the first thermal conductor layer, and the conductive vias. A heatsink is embedded in the PCB between the vias and the second thermal conductor layer to further promote heat conduction away from the flip chip. Heat can be conducted from the PCB with a second heatsink, such as a housing that encloses the PCB. The second heatsink either directly contacts the second thermal conductor layer, or makes thermal contact with the second thermal conductor layer through a thermally-conductive lubricant or adhesive.

Flip chip on circuit board with enhanced heat dissipation and method

A method of preventing solder reflow of a SMT component (14) attached with solder (22) to a circuit board (10) that subsequently undergoes a wave soldering operation. The method generally entails the use of a thermal shield (18, 28) that is either part of the support structure (12) for the circuit board (10) during the wave soldering operation, or a temporary mask (28) applied directly to a surface of the circuit board (10). In each case, the thermal shield (18, 28) is configured to contact and completely cover a limited surface region of the circuit board (10) directly opposite the SMT component (14). To provide adequate thermal protection, the covered surface region is preferably as large as or larger than the surface area of the component (14). In a preferred embodiment, the perimeter of the thermal shield (18, 28) has a tapered thickness, e.g., a beveled edge, that enables uninterrupted wave soldering of the surface surrounding the thermal shield (18, 28).

Method of preventing solder reflow of electrical components during wave

A process and combination of materials for underfilling a surface-mount IC device (12), such as a flip chip, for the purpose of increasing the thermal cycle fatigue life of the terminals (14) that attach the device (12) to a thin-laminate organic circuit board (10), such as a printed wiring board (PWB) or printed circuit board (PCB). The process parameters and materials, including the underfill (20), masking (22) and cleaning materials used, exhibit a synergistic effect that increases thermal cycle fatigue resistance to a level at which a flip chip processed in accordance with this invention is capable of reliably withstanding at least 1000 one-hour cycles between -40.degree. C. and 150.degree. C. The materials and the manner in which the device (12) and circuit board (10) are prepared for application of the materials are critical to eliminating tendencies for inconsistent reliability in underfilled SM devices.

Growing community of inventors

Kokomo, IN, United States of America

Darrel Eugene Peugh