International Business Machines Corporation

Darleen Mayo

Voya Rista Markovich

Christina Marie Boyko

Thurston Bryce Youngs, Jr

Richard W Carpenter

Joseph Gene Sabia

Cindy M Reidsema

Francis J Bucek

Robert B Conn

The present invention provides an improved circuit board for mounting integrated circuit chips and a technique for manufacturing the circuit board. The board permits direct chip attachment to the circuit board by providing the necessary geometry for the footprint pattern of the chip connections without the necessity of multi-level packaging using chip carriers. The circuit board includes a substrate with plated through holes, and a film of photoresist dielectric material disposed on the substrate. The dielectric material is photo patterned to form vias which are then filled with conductive material. Electrical connection pads are formed on the exposed surface of the film of dielectric material in the pattern of the chip footprint to be mounted thereon. The vias and plated through holes are arranged in groups and patterns which provide some direct connection between the pads and plated through holes, some pads wired to vias on the exposed surface of the film of dielectric material and some vias wired to plated through holes on the surface of the substrate.

Printed circuit board with aligned connections and method of making same

Multiple circuit functions embodied in electrical circuit lines and areas are supported by a multilayered printed circuit board of various lengths and widths (defining 'x' and 'y' directions) and of various thicknesses (defining a 'z' direction) all on a single board. Several ways of achieving such variations in thickness include providing two layer subassemblies arranged in an alternate and intermediate manner, one subassembly being adapted to support electrical circuit lines and areas, and the other subassembly being formed of thin film dielectric material of various precalculated thicknesses. Another way of achieving a variation in thickness is to limit the surface covered by circuit lines with a pre-calculated core thickness.

Multiple wiring and X section printed circuit board technique

Growing community of inventors

Knightdale, NC, United States of America

Darleen Mayo