Stratec Consumables Gmbh

Sony Dadc Austria Ag

Dario Borovic

Gottfried Reiter

Alfred Paris

Michael Pingert

A microfluidic device comprises a first substrate () made of a first polymer material and a second substrate () made of a second polymer material, the first () and second () substrates having respective bonding surfaces (), at least one of the bonding surfaces () having channel formations () so that, when the bonding surfaces () are bonded by surface deformation to one another, the bonded first and second substrates () and the channel formations () form at least part of a microfluidic channel network comprising a plurality of microfluidic channels, wherein one or more indicator pits (), separate to the channel formations () defining the microfluidic channel network, are formed in at least one of the bonding surfaces (), so that surface deformation caused by the bonding process causes a change of configuration of the one or more indicator pits ().

Method for manufacturing a microfluidic device

A microfluidic device includes a first substrate made of a first polymer material and a second substrate made of a second polymer material, the first and second substrates having respective bonding surfaces, at least one of the bonding surfaces having channel formations so that, when the bonding surfaces are bonded by surface deformation to one another, the bonded first and second substrates and the channel formations form at least part of a microfluidic channel network comprising a plurality of microfluidic channels, wherein one or more indicator pits, separate to the channel formations defining the microfluidic channel network, are formed in at least one of the bonding surfaces, so that surface deformation caused by the bonding process causes a change of configuration of the one or more indicator pits.

Microfluidic device

A microfluidic device comprising in sequence first, second and third layers of plastics materials. A microfluidic circuit including a laterally extending microfluidic channel is formed at the interface between the first and second layers by surface structure in one or both of the first and second layers. A via is formed in the third layer for supplying or removing fluid to or from the microfluidic circuit. A conduit is formed in the second layer to provide fluid communication between the microfluidic channel and the via. A weld is formed at the interface between the second and third layers in a continuous closed path around the via and forms a fluid-tight seal for fluid flow between the via and the microfluidic circuit.

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Hallein, Austria

Dario Borovic