Asm IP Holding B.v.

Daria Nevstrueva

Charles Dezelah

Suvi P Haukka

Eva E Tois

Michael Eugene Givens

In some embodiments, methods are provided for simultaneously and selectively depositing a first material on a first surface of a substrate and a second, different material on a second, different surface of the same substrate using the same reaction chemistries. For example, a first material may be selectively deposited on a metal surface while a second material is simultaneously and selectively deposited on an adjacent dielectric surface. The first material and the second material have different material properties, such as different etch rates.

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Helsinki, Finland

Daria Nevstrueva