Intel Corporation

Henkel Ag & Company, Kgaa

Henkel IP Holding Gmbh

Henkel (china) Company Limited

Daoqiang Lu

Henning Braunisch

Jiangqi He

Wei Shi

Qing A Zhou

Chuan Hu

Gilroy J Vandentop

Anna M George, Legal Representative

Eric Jin Li

Xiang Yin Zeng

Tian-An Chen

Valery M Dubin

Rajashree Raji Baskaran

Christopher L Rumer

Jiamiao Tang

Shabbir Attarwala

Paul A Koning

Rui Zhang

Gudbjorg H Oskarsdottir

Tiffany Byrne

Darcy E Fleming

Shriram Ramanathan

Steven N Towle

Hongyu Wang

Yiqun Bai

Susheel G Jadhav

Ming Fang

Chunfu Chen

Dongming He

Junichi Sawanobori

Chongjian Song

Yinxiao Yuan

Johanna M Swan

Ian A Young

Gregory Martin Chrysler

Nitin A Deshpande

John Heck

Xin Wang

Bruce A Block

Charan K Gurumurthy

Mostafa Naguib Abdulla

Mark B Trobough

Andrew Alduino

Zhiyong Wang

Edris M Mohammed

Edward A Zarbock

James Wang

John Tang

Bram Leader

Masao Kanari

Haixiao Sun

Victor Xinya Lu

Heqiang Zhang

Zuohe Wang

Minrui Li

Jianqqi He

Mohammed Edris

Nathaniel Arbizu

Hai Xiao Sun

Raymond Zhang

Aiying Xu

Huiying Yang

Ming Dong Cui

Gregory V Christensen

Jadhav G Susheel

Benchi Lu

Nicolas Zhou

This invention relates to a light curable composition, comprising at least one acrylate monomer, at least one acrylamide compound, at least one acrylate oligomer, and at least one photoinitiator. The light curable composition of the present invention exhibits excellent elongation property after curing and is suitable to be applied for 3D printing.

Light curable composition

The present invention relates to a photo-curable liquid optically clear adhesive composition, to a cured adhesive and an article produced therefrom, and to the use thereof.

Photo-curable liquid optically clear adhesive composition and the use thereof

The present invention provides a photo-curable adhesive composition for display panel assembly comprising a) at least one polyurethane acrylate having Tg value from &#x2212;70 to 20&#xb0; C.; b) at least one (meth)acrylate monomer; c) at least one chain transfer agent; d) at least two thixotropy agents, wherein first thixotropy agent is selected from the group consisting of hydrophobic fumed silica, hydrophilic fumed silica and mixtures thereof and second thixotropy agent is selected from the group consisting of modified urea, polyhydroxycarboxylic acid esters and mixtures thereof; e) at least one photoinitiator; f) at least one plasticizer; and g) at least one defoamer. The photo-curable adhesive composition according to the present invention can be used in bonding two transparent substrates together or in bonding one transparent substrate and one opaque substrate together. Furthermore, the composition according to the present invention can be used in a process of making an optical assembly.

Photo-curable adhesive composition, preparation and use thereof

Disclosed is an adhesive composition, comprising: (A) a silane terminated oligomer; (B) a (meth)acrylate monomer; (C) optionally a (meth)acrylate oligomer; (D) a photoinitiator; and (E) optionally an organometallic catalyst. The adhesive composition is both ultraviolet curable and moisture curable. Also disclosed is a method of applying the adhesive composition, comprising: (i) coating the adhesive onto the substrate to be bonded; (ii) laminating or stacking the substrate to be bonded to form an assembly; (iii) irradiating the assembly by ultraviolet irradiation; and (iv) placing the assembly under the room temperature. The adhesive composition is useful in display panels, touch panels and optical devices.

Ultra-violet-curable and moisture-curable adhesive composition

A process for binding a top substrate to a base substrate is disclosed, in which

Process for binding substrates with a liquid optically clear photo-curable adhesive

The present invention provides a dual-curable adhesive composition, comprising: component (a): an epoxy resin; at least one selected from component (b) and component (c), wherein component (b) is a (meth)acrylate monomer, and component (c) is an oligomer containing a (meth)acryloxy group; component (d): a thermal polymerization catalyst which catalyzes the thermal polymerization reaction of component (a); and component (e): a photo polymerization initiator which initiates the photo polymerization reaction of component (a) and at least one selected from component (b) and component (c), wherein component (e) is a mixture of a cationic photo polymerization initiator and a radical photo polymerization initiator. The dual-curable adhesive composition of the present invention is used for bonding or laminating a transparent substrate with another transparent substrate, or bonding or laminating a transparent substrate with a non-transparent substrate. The present invention also provides a process for bonding substrates.

Dual-curable adhesive composition, use thereof, and process for bonding substrates

The present invention provides an adhesive composition, which can be cured through three ways: UV-radiation curing, thermal-radiation curing and moisture-curing. The adhesive composition comprises a) an oligomer having an isocyanate group and a (meth)acryloxy group; b) a (meth)acrylic monomer and/or oligomer not having an isocyanate group; c) a photoinitiator; and d) a peroxide.

Triply curable optically clear adhesive

The present invention relates to an optical transparent dual cure adhesive, and process for preparing this dual cure adhesive, and uses thereof. More particularly, the present invention relates to optical transparent adhesive, which is both capable of being UV-light cured and thermal cured, for example, it can be used for the bonding of touch screen of an electronic device and substrate.

Optical transparent dual cure adhesives composition

The present invention relates to a photocurable adhesive composition and the use of the same. Specifically, said photocurable adhesive composition mainly comprises, based on 100 parts by weight of the adhesive composition, component A: from 70 to 99 parts by weight of one or more polymers carrying (meth)acryloxyl group; component B: from 0 to 30 parts by weight, preferably from 0 to 25 parts by weight of one or more (meth)acrylates monomers; component C: from 0.5 to 10 parts by weight of at least one UV absorber; and component D: from 0 to 5 parts by weight of antioxidant. The present invention also relates to the use of the adhesive composition mentioned above in the production of an ITO substrate for temporarily bonding a substrate and a temporary carrier and going through a high temperature processing, for example, at a temperature of &#x2267;160&#xb0; C., preferably, from 160&#xb0; C. to 260&#xb0; C., more preferably from 240&#xb0; C. to 250&#xb0; C.

Photocurable adhesive composition and use of the same

The present invention relates to a solder paste composition, a solder paste and a soldering flux. The soldering flux comprises a resin, a thixotropic agent, an activator, a solvent as well as a long-chain thiol and/or an organic chelating agent.

Solder paste composition, a solder paste and a soldering flux

A method of fabricating a microelectronic package having a direct contact heat spreader, a package formed according to the method, a die-heat spreader combination formed according to the method, and a system incorporating the package. The method comprises metallizing a backside of a microelectronic die to form a heat spreader body directly contacting and fixed to the backside of the die thus yielding a die-heat spreader combination. The package includes the die-heat spreader combination and a substrate bonded to the die.

Microelectronic package having direct contact heat spreader and method of manufacturing same

The present invention provides a method for bonding two substrates using a UV radiation curing-redox curing adhesive system having a shadow area and a transparent area, comprising: bonding the shadow area of the substrates using a redox curing adhesive system, and bonding the transparent area of the substrates using a liquid optically clear adhesive containing UV initiators.

Method for bonding substrates using a UV radiation curing-redox curing adhesive system

A technique to fabricate a package. A thin wafer supported by a wafer support substrate (WSS) is formed. The WSS-supported thin wafer layer is diced into a plurality of WSS-supported thin dice. A WSS-supported thin die is bonded to a first heat spreader (HS) to form a HS-reinforced thin die.

Heat spreader as mechanical reinforcement for ultra-thin die

A method for aligning at least two photonic components over an interposer, and an optical package that may align such components. The method may include providing an interposer; fabricating electrical conductors passing from one surface of the interposer to an opposite surface of the interposer at selected contact positions; soldering the photonic components over the selected contact positions on the first surface, while allowing solder self-alignment. Other embodiments are described and claimed.

Method of mounting an optical device

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Chandler, AZ, United States of America

Daoqiang Lu