The University of Texas System

Other

Espalin, David

Danny W Muse

Ryan B Wicker

Eric MacDonald

Francisco Medina

David Espalin

Rodolfo Salas

The present invention provides a system and method for making a three-dimensional electronic, electromagnetic or electromechanical component/device by: (1) creating one or more layers of a three-dimensional substrate by depositing a substrate material in a layer-by-layer fashion, wherein the substrate includes a plurality of interconnection cavities and component cavities; (2) filling the interconnection cavities with a conductive material; and (3) placing one or more components in the component cavities.

Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices

Systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic, or electromechanical component/device.

Methods for connecting inter-layer conductors and components in 3D structures

The present invention provides systems and methods for embedding a filament or filament mesh in a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device by providing at least a first layer of a substrate material, and embedding at least a portion of a filament or filament mesh within the first layer of the substrate material such the portion of the filament or filament mesh is substantially flush with a top surface of the first layer and a substrate material in a flowable state is displaced by the portion of the filament and does not substantially protrude above the top surface of the first layer, allowing the continuation of an additive manufacturing process above the embedded filament or filament mesh. A method is provided for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.

Methods and systems for embedding filaments in 3D structures, structural components, and structural electronic, electromagnetic and electromechanical components/devices

An electronic gaming die includes an enclosure, a flexible substrate, a number of light emitting diodes, a sensor, a processor and a battery. The enclosure has N sides where N is equal to or greater than 4. The flexible substrate folds into N sides and fits into an interior of the enclosure, wherein each side has an inner face, an outer face and is assigned an integer from 1 to N. The light emitting diodes are disposed on the outer face of each side of the flexible substrate, wherein the number of light emitting diodes equals the integer assigned to the side of the flexible substrate. The sensor, processor and battery are disposed on one of the inner faces of the flexible substrate.

Electronic gaming die

The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.

Growing community of inventors

El Paso, TX, United States of America

Danny W Muse