Applied Materials, Inc.

Danny D Wang

Dmitry Lubomirsky

Juan Carlos Rocha-Alvarez

Shu-Kwan Danny Lau

Zhong Qiang Hua

Yeuk-Fai Edwin Mok

Rupankar Choudhury

Jun Tae Choi

Jason Michael Lamb

Shainish Nellikka

Zhiyuan Ye

Kartik Bhupendra Shah

Abhishek Dube

Senh Thach

Ala Moradian

Brian Hayes Burrows

Richard Omar Collins

Toshiyuki Nakagawa

Enle Choo

Brigitte C Stoehr

Mark Wiltse

Frank C Ma

Dennis Koosau

Abraham Palaty

Erwin Polar

Raja Murali Dhamodharan

Vinodh Ramachandran

Paul Exline

A heating module for a substrate processing chamber includes heating lamps coupled to a reflector plate and a heat exchanger. The heat exchanger cools a gas within the heating module. A fan within the heating module circulates the gas through apertures in the reflector plate to cool the heating bulbs. The gas is cooled by the heat exchanger, and is recirculated. One or more shrouds directs the gas as the gas is being circulated.

Air shrouds with integrated heat exchanger

A process chamber includes a chamber body having a ceiling disposed above a floor with a chassis and an injector ring disposed therebetween. Upper and lower clamp rings secure the upper and floors, respectively, in place. An upper heating module is coupled to the upper clamp ring above the ceiling. A lower heating module is coupled to the lower clamp ring below the floor.

Epitaxial deposition chamber

Alignment systems employing actuators provide relative displacement between lid assemblies of process chambers and substrates, and related methods are disclosed. A process chamber includes chamber walls defining a process volume in which a substrate may be placed and the walls support a lid assembly of the process chamber. The lid assembly contains at least one of an energy source and a process gas dispenser. Moreover, an alignment system may include at least one each of a bracket, an interface member, and an actuator. By attaching the bracket to the chamber wall and securing the interface member to the lid assembly, the actuator may communicate with the bracket and the interface member to provide relative displacement between the chamber wall and the lid assembly. In this manner, the lid assembly may be positioned relative to the substrate to improve process uniformity across the substrate within the process chamber.

Alignment systems employing actuators providing relative displacement between lid assemblies of process chambers and substrates, and related methods

A method and apparatus for supporting and transferring a substrate in a semiconductor wafer processing system. In one aspect, a support ring having one or more substrate support members mounted thereon and defining a central opening therein for receipt of a substrate support member during processing is disclosed. In another aspect, a substrate handler blade having a plurality of substrate supports disposed thereon is provided which is adapted to support a substrate thereon and effectuate substrate transfer between the substrate handler blade and the support ring.

Method and apparatus for transferring and supporting a substrate

A semiconductor wafer processing apparatus, and more specifically, a semiconductor substrate support pedestal having a substrate support, an isolator, and first and second heat transfer plates for providing a controllable, uniform temperature distribution across the diameter of a semiconductor wafer. A semiconductor wafer placed upon the pedestal is maintained uniformly at a predetermined temperature by heating the wafer with one or more electrodes embedded within the substrate support and cooling the wafer with a fluid passing through the first and second heat transfer plates.

Method and apparatus for thermal control of a semiconductor substrate

Growing community of inventors

San Jose, CA, United States of America

Danny D Wang