Abb Schweiz Ag

Audi Ag

Hitachi Energy Ltd

Hitachi Energy Switzerland Ag

Abb Technology Oy

Abb Technology Ag

Abb S.p.a.

Abb Research Ltd.

Daniele Torresin

Bruno Agostini

Francesco Agostini

Mathieu Habert

Thomas Gradinger

Andrey Petrov

Fabian Mohn

Antonello Antoniazzi

Juergen Schuderer

Matteo Bortolato

Munaf Rahimo

Zhiguo Pan

Pietro Cairoli

Andreas Apelsmeier

Colin Tschida

Didier Cottet

Timo Koivuluoma

Jürgen Schuderer

Benjamin Söhnle

Pierantonio Arrighetti

Luca Raciti

Milad Maleki

Felix Traub

Chunlei Liu

Daniel Kearney

Gernot Riedel

Alessandro Adami

Oleksandr Sologubenko

Davide Leoni

Francesco Moraschinelli

Chunlei Lui

David Baumann

An apparatus includes a baseplate and a cooler providing a cooling channel adapted for providing a coolant flow. An electronic circuit includes a power semiconductor device disposed at the first side of baseplate. A footprint of the power semiconductor device defines a device area on the first side. A cooling area at the second side of the baseplate opposite the device area is adapted for dissipating heat from the baseplate by bringing the cooling area into thermal contact with the coolant flow in the cooling channel. An auxiliary area is located on the second side of the baseplate adjacent to the cooling area. The auxiliary area includes a flow guide for reducing a flow rate of the coolant flow in the auxiliary area and the cooling channel is adapted to receive the cooling area and the flow guide.

Arrangement comprising a baseplate for a power semiconductor module and a cooler

A heat dissipation device is provided herein. The heat dissipation device includes an evaporator chamber at least partially filled with a working fluid to be evaporated when being heated by a heat source; at least one condenser chamber for receiving evaporated working fluid and for condensing the evaporated working fluid, wherein the condenser chamber is interconnected with the evaporator chamber in a fluid conductive manner; and at least one air fin element interconnected between the condenser chamber and one of a further condenser chamber and a side wall of the heat dissipation device; wherein the air fin element has a triply periodic surface providing air fins.

Heat dissipation device

A power converter including a semiconductor module having a base plate and a cooling housing. The cooling housing includes a receptacle plate and a cover. The receptacle plate has an opening. The receptacle plate is connected to the base plate of the semiconductor module around the opening. The cover is connected to the receptacle plate along a closure path around the opening, and either the receptacle plate or the cover is formed as a stamped or deep-drawn plate.

Direct cooling of a power converter by using a stamped plate

A vapor chamber includes a bottom cover, a top cover, a crate element, and at least one porous pillar. The bottom cover is configured to receive waste heat from an electronic component. The top cover is arranged on the bottom cover, and the bottom cover and the top cover are formed such that a vapor cavity configured to accommodate a liquid is formed between the bottom and top cover. The crate element is configured to provide mechanical strength to the vapor chamber, and has at least one compartment. The compartment(s) are formed by at least three side panels that are connected to each other, where the at least three side panels extend from the bottom cover to the top cover. The porous pillar(s) are configured to transfer the liquid from the top cover to the bottom cover and are arranged in the compartment.

Vapor chamber for cooling an electronic component, electronic arrangement, and method for manufacturing the vapor chamber

In one embodiment a power semiconductor module includes a substrate having a first substrate side for carrying an electric circuit and having a second substrate side being located opposite to the first substrate side. The second substrate side has a flat surface and is adapted for coming in contact with a cooler. A cooling area that is surrounded by a connecting area is located at the second substrate side. A first casing component of the cooler is connected to the second substrate side at the connecting area and a second casing component is connected to the first casing component such that a cooling channel for providing the cooling area with cooling fluid is provided between the first casing component and the second casing component. A cooling structure can be welded to the cooling area at the second substrate side.

Arrangement of a power semiconductor module and a cooler

Disclosed herein is a blank for a heat-transfer device that includes a vapor chamber enclosed by a body of the heat-transfer device, and a charging tube connected to the vapor chamber, wherein a part of the charging tube protruding from the body has at least one unsealed sealing zone with an oblong flow area, where a width of the charging tube exceeds a height of the charging tube.

Blank for a heat-transfer device and method to produce a heat-transfer device

An electric power converter device includes a first power semiconductor module and a frame for a closed cooler. The first power semiconductor module includes a first base plate having a first main side, a second main side opposite the first main side and a lateral side surface extending along a circumferential edge of the first base plate and connecting the first and the second main side. The frame is attached to the second main side of the first base plate. The first base plate has a first step on the second main side along the circumferential edge of the first base plate to form a first recess along the circumferential edge of the first base plate, in which first recess a first portion of the frame is received.

Electric power converter device with improved integration of cooler frame

A semiconductor component, including a support frame and at least one semiconductor module attached to the support frame, wherein the support frame includes a respective passage (on the edge of which a base plate of the semiconductor module rests, wherein the base plate is soldered to the support frame.

Semiconductor component, motor vehicle, and method for producing a semiconductor component

An arc chamber for a low voltage switching device including an insulating casing, having a first and a second lateral walls, a rear and a front wall, that defines an internal space housing a number or arc-breaking plates, a top wall of the casing having a discharge opening for venting off the gases from the internal space, the discharge opening being covered by a top cover. The arc chamber for a low voltage switching device includes a filter made of an open cell metal foam that is positioned at the discharge opening.

Arc chamber for a low-voltage switching device

One embodiment provides a method of providing a power semiconductor module with a cooler. A power semiconductor module includes a substrate having a first substrate side for carrying at least one electric circuit and having a second substrate side being located opposite to the first substrate side. The second substrate side is connected to a first baseplate side and the baseplate also includes a second baseplate side being located opposite to its first baseplate side and being adapted for coming in contact with the cooler. The cooler includes a first casing component and a second casing component. The baseplate side is equipped with a cooling area that is surrounded by a connecting area.

Power semiconductor module and method of forming the same

A heat exchanger includes: a baseplate having a first side and a second side opposite the first side, the first side being coupled to a thermosiphon, one or more electronic components being mounted on the second side. The baseplate has a two-phase heat spreading structure. In an embodiment, the heat exchanger includes a thermosiphon.

Heat exchanger with integrated two-phase heat spreader

The invention relates to a method which is suited for manufacturing a 3D-vapor chamber in a defined and efficient manner. Especially, the present method provides a solution for providing a vapor chamber having an evaporator and a condenser made from a first part and a second part, wherein continuity of internal structures is given which in turn provides an efficient working behaviour of the vapor chamber.

Method of forming a 3D-vapor chamber

A surge arrester system includes a surge arrester, and an active cooling system having a cooling interface in contact with the surge arrester and operative to transfer heat from the surge arrester. The active cooling system includes a forced convection apparatus operative to provide forced convection cooling. A circuit breaker system includes a power semiconductor switch and an active cooling system constructed to cool the power semiconductor switch. The active cooling system includes a forced convection apparatus configured to provide forced convection cooling. The power semiconductor switch is in contact with the active cooling system. A surge arrester is disposed adjacent to and in contact with the active cooling system. The active cooling system includes a cooling interface constructed for contact with the surge arrester and operative to provide cooling to the surge arrester. The power semiconductor switch and the surge arrester dissipate power alternatively.

Surge arrester system and circuit breaker system

A heat exchange device may be based on a pulsating heat pipe and a cooling arrangement. The heat exchange device may include a plurality of pipes to provide fluid paths between a first fluid distribution element and a second fluid distribution element. Each pipe of the plurality of pipes may include a group of channels. Each of the first and second fluid distribution elements may include a plate of a first type. Each plate of the first type may include openings for providing alignment functionality for the plurality of pipes. The first fluid distribution element may include a plate of a second type that may include openings for providing fluid paths between the pipes. The plate of the second type may be positioned on a side of the plate of the first type of plates of the first fluid distribution element that is opposite to the second fluid distribution element.

Heat exchange device based on a pulsating heat pipe

A heat exchanger assembly is disclosed. The heat exchanger assembly comprises at least one passive cooling circuit, the passive cooling circuit including an evaporator connectable to a device to be cooled for conducting heat from the device to be cooled to the cooling fluid within the evaporator, thereby evaporating the cooling fluid, and a condenser interconnected with the evaporator for receiving the evaporated cooling fluid from the evaporator, releasing heat from the cooling fluid to an environment of the condenser, thereby condensing the cooling fluid, and for returning the condensed cooling fluid to the evaporator; and an active partial circuit comprising a compressor and an auxiliary condenser, the active partial circuit being activatable and deactivatable and being connected to the passive cooling circuit for receiving, in an activated state of the active partial circuit, the cooling fluid from the evaporator, for compressing the received cooling fluid by the compressor, for releasing heat, by the auxiliary condenser, from the compressed cooling fluid to an environment of the auxiliary condenser, and for returning the condensed cooling fluid to the evaporator. Furthermore, the passive cooling circuit is a base-to-air type thermosiphon or an air-to-air type thermosiphon.

Growing community of inventors

Birmenstorf, Switzerland

Daniele Torresin