Nederlandse Organisatie Voor Toegepast-natuurwetenschappelijk Onderzoek Tno

Daniele Piras

Paul Louis Maria Joseph Van Neer

Hamed Sadeghian Marnani

Maarten Hubertus Van Es

Peter Johan Harmsma

Marcus Johannes Van Der Lans

Maurits Sebastiaan Van Der Heiden

Robert Karl Altmann

Laurent Fillinger

Benoit Andre Jacques Quesson

Erwin Johannes Martinus Giling

Kodai Hatakeyama

Sri Ram Shankar Rajadurai

Uilke Stelwagen

Benoit André Jacques Quesson

The present document relates to a method of performing acoustic scanning probe microscopy for imaging structures underneath a substrate surface, comprising: applying an acoustic input signal to the substrate having a frequency above 1 gigahertz, detecting a return signal, and analyzing the return signal for obtaining information on the embedded structures. The step of applying the acoustic input signal comprises applying a plurality of acoustic signal components which each include a selected frequency. The step of detecting includes detecting a response signal for each of the plurality of acoustic signal components. The frequencies are selected such that the components provide a composite signal being a pulse signal of limited time duration. The invention is further directed at a scanning probe microscopy system and a computer program product.

Method, system and computer program for performing acoustic scanning probe microscopy

The photonic integrated device for converting a light signal into sound comprises—a substrate having a substrate surface, an optical waveguide on the substrate surface, a photo-acoustic conversion body, comprising at least one volume of fractionally light absorbing material or formed entirely of fractionally light absorbing material, wherein a width of the photo-acoustic conversion body is greater than a width of the optical waveguide and means for enhancing distribution of light from the optical waveguide over the photo-acoustic conversion body.

Photonic integrated device for converting a light signal into sound via a solid photo-acoustic converter

The photonic integrated device comprises a substrate, a plurality of mechanical resonator structures on a surface of the substrate, exposed to receive sound waves from outside the device; a plurality of sensing optical waveguides, each sensing optical waveguide at least partly mechanically coupled to at least one of the mechanical resonator structures, or a sensing optical waveguide that is at least partly mechanically coupled to all of the mechanical resonator structures; an input optical waveguide on the surface of the substrate, coupled to the plurality of sensing optical waveguides or the single sensing optical waveguide, for supplying light to the plurality of sensing optical waveguides or the single sensing optical waveguide; at least one output optical waveguide on the surface of the substrate, coupled to the plurality of sensing optical waveguides or the single sensing optical waveguide, for collecting light from the plurality of sensing optical waveguides or the single sensing optical waveguide that has been affected by vibration of plurality of mechanical resonator structures.

Photonic integrated device for converting sound into a modulation of properties of light in the device

The present invention relates to a method of performing subsurface imaging of embedded structures in a substrate underneath a substrate surface, the method comprising the steps of applying, using a signal application actuator, an acoustic input signal to the substrate, detecting, using a vibration sensor, a return signal from the substrate and analyzing the return signal for obtaining information on the embedded structures, for enabling imaging thereof wherein the step of applying the acoustic input signal comprises applying a discontinuous signal of an acoustic signal component to the substrate, the acoustic signal component having a frequency above 1 gigahertz, such that the return signal includes a scattered fraction of the discontinuous signal scattered from the embedded structures. The invention further relates to a system.

Method of and system for performing subsurface imaging using vibration sensing

The present document relates to a heterodyne scanning probe microscopy (SPM) method for subsurface imaging, and includes: applying an acoustic input signal to a sample and sensing an acoustic output signal using a probe. The acoustic input signal comprises a plurality of signal components at unique frequencies, including a carrier frequency and at least two excitation frequencies. The carrier frequency and the excitation frequencies form a group of frequencies, which are distributed with an equal difference frequency between each two subsequent frequencies of the group. The difference frequency is below a sensitivity threshold frequency of the cantilever for enabling sensing of the acoustic output signal. The document also describes an SPM system.

Heterodyne scanning probe microscopy method and scanning probe microscopy system

Methods and systems for subsurface imaging of nanostructures buried inside a plate shaped substrate are provided. An ultrasonic generator at a side face of the substrate is used to couple ultrasound waves (W) into an interior of the substrate. The interior has or forms a waveguide for propagating the ultrasound waves (W) in a direction (X) along a length of the substrate transverse to the side face. The nanostructures are imaged using an AFM tip to measure an effect (E) at the top surface caused by direct or indirect interaction of the ultrasound waves (W) with the buried nanostructures.

Subsurface atomic force microscopy with guided ultrasound waves

The document relates to a method of performing subsurface imaging of embedded structures underneath a substrate surface, using an atomic force microscopy system. The system comprises a probe with a probe tip, and a sensor for sensing a position of the probe tip. The method comprises the steps of: positioning the probe tip relative to the substrate: applying a first acoustic input signal to the substrate; applying a second acoustic input signal to the substrate; detecting an output signal from the substrate in response to the first and second acoustic input signal; and analyzing the output signal. The first acoustic input signal comprises a first signal component and a second signal component, the first signal component comprising a frequency below 250 megahertz and the second signal component either including a frequency below 2.5 megahertz or a frequency such as to provide a difference frequency of at most 2.5 megahertz with the first signal component, such as to enable analysis of an induced stress field in the substrate; and wherein the second acoustic input signal comprises a third signal component having a frequency above 1 gigahertz, such that the return signal includes a scattered fraction of the second acoustic input signal scattered from the embedded structures. This enables to perform imaging a various depths in one pass, across a large range of depths.

Method of and atomic force microscopy system for performing subsurface imaging

Methods and systems for measuring a fluid flow comprise a plurality of transceivers disposed at predetermined locations distributed along a perimeter around the fluid flow. The transceivers transmit and receive acoustic signals through the fluid flow there between. A plurality of different acoustic paths through the fluid flow are formed between different transceiver pairs. Different time intervals are measured between respective times of transmitting and receiving the acoustic signals; and along the plurality of different acoustic paths. A velocity map of the fluid flow is calculated by fitting the measured different time intervals to a model of the fluid flow. The model of the fluid flow defines a velocity map with different flow velocities in a cross-section plane transverse to the fluid flow.

Acoustic measurement of a fluid flow

Atomic force microscopy system comprising an atomic force microscopy device and a substrate carrier having a carrier surface carrying a substrate. The substrate has a substrate main surface and a substrate scanning surface opposite the substrate main surface. The atomic force microscopy device comprises a scan head including a probe. The probe comprises a cantilever and a probe tip arranged on the cantilever. The atomic force device further comprises an actuator cooperating with at least one of the scan head or the substrate carrier for moving the probe tip and the substrate carrier relative to each other in one or more directions parallel to the carrier surface for scanning of the substrate scanning surface with the probe tip. A signal application actuator applies, during said scanning, an acoustic input signal to the substrate, said acoustic input signal generating a first displacement field in a first displacement direction only. A tip position detector monitors motion of the probe tip relative to the scan head during said scanning for obtaining an output signal. The tip position detector is arranged for monitoring motion of the probe tip only in a direction orthogonal to the displacement direction.

Atomic force microscopy system, method for mapping one or more subsurface structures located in a semiconductor device or for monitoring lithographic parameters in a semiconductor device and use of such an atomic force microscopy system

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Amsterdam, Netherlands

Daniele Piras