Stmicroelectronics Gmbh

Institute of Microelectronics

Daniel Yap

Thiam Beng Lim

Tai Chong Chai

James Tan

Hung Meng Loh

Eric Neo

Yong Chua Teo

Raymundo M Camenforte

Ray Camenforte

A method of forming a solder connection includes forming a solder mask on a thermal pad of a printed circuit board. The solder mask leaves unmasked portions of the thermal pad and forming the solder mask includes forming a plurality of mask stripes extending from edges of each unmasked portion towards a center of the unmasked portion. The method includes depositing solder paste on the unmasked portions of the thermal pad and placing an exposed thermal pad of an integrated circuit package on the solder paste deposited on the thermal pad of the printed circuit board. The method includes forming a solder connection by heating the solder paste between the unmasked portions of the thermal pad on the printed circuit board and the exposed thermal pad of the integrated circuit package.

Solder mask for thermal pad of a printed circuit board to provide reliable solder contact to an integrated circuit

A lead-frame for connecting and supporting an integrated circuit having an apertured frame with dimensions smaller than the corresponding dimensions of the chip so that chip-pad shoulder can be eliminated and the chip attach fillet is made remote from the chip corner.

Lead frame for an integrated circuit chip

A lead-frame for connecting and supporting an integrated circuit chip with a chip accommodating zone with inwardly extending ears for supporting the chip including minimum shoulder area, and having open crack and delamination stopping regions.

Lead frame for an integrated circuit chip (integrated circuit peripheral support)

Growing community of inventors

Singapore, Singapore

Daniel Yap