Intel Corporation

S N F

Daniel Willis

Yun Ling

Scott L Noble

Jonathan W Thibado

John M Lynch

Yinan Wu

Dan H Gerbus

John Fallin

Anthony M Constantine

Guixiang Tan

Eugene Nelson

Brent A Hill

Cary D Cottrell

Thai (Daniel) Tong

Danny Jay Wilcox

Embodiments include semiconductor packages. A semiconductor package includes a plurality of dies on a package substrate, and a plurality of smart dies on the package substrate, where the plurality of smart dies include a plurality of interconnects and a plurality of capacitors. The semiconductor package also includes a plurality of routing lines coupled to the dies and the smart dies, where the routing lines are communicatively coupled to the interconnects of the smart dies, where each of the dies has at least two or more routing lines to communicatively couple the dies together, and where one of the routing lines is via the interconnects of the smart dies. The capacitors may be a plurality of metal-insulator-metal (MIM) capacitors. The dies may be a plurality of active dies. The routing lines may communicatively couple first and second active dies to first and second smart dies.

Enhanced dummy die for MCP

The systems and methods disclosed herein provide an improved processor package to determine a connection type between the package and an external circuit and to optimize processor performance based on the connection type. As a non-limiting example, a processor package consistent with the present disclosure may include a central processing unit (CPU) die and a plurality of pins (including two connection detection pins) to connect the package to a motherboard. The CPU die may include connection determination logic and execution policy logic, implemented via processor code ('p-code'), as well as a more typical processor.

Processor package with optimization based on package connection type

The present subject matter may include an electronic device. The electronic device may include a motherboard socket body. The motherboard socket body may be adapted to couple with a processor. The motherboard socket body may define an aperture in the motherboard socket body. The electronic device may include a socket insulator. The socket insulator may be coupled with the aperture in the motherboard socket body. The socket insulator may include an insulator body that may be sized and shaped to close the aperture in the motherboard socket body. The socket insulator may be configured to isolate electrical communication in portions of the motherboard socket body.

Socket cavity insulator

Provided are an apparatus, system, and method relating to detecting, during a system boot operation, whether a device arranged to implement a first bus interface protocol is coupled to a system through a connector. A bus clock is programmed to be off in response to detection of no device implementing the first bus interface protocol being coupled to the system through the connector. After the bus clock is programmed to be off, a buffer is reprogrammed to assume that the connector implements a second bus interface protocol coupled to a storage device. After reprogramming the buffer, the apparatus, system, and method detect whether a device arranged to implement the second bus interface protocol is coupled to the connector, and the device arranged to implement the second bus interface protocol is initialized in response to detection that the device is coupled to the connector. Other embodiments are described and claimed.

Multiple storage devices implemented using a common connector

An electronic system includes a system board, a connector mounted on the system board, an electronic card attached to the connector, the card overhanging the connector at least on an inward end of the card, and a guide secured to the system board and spaced from the connector, wherein the guide is adapted to inhibit lateral movement of the card. The guide includes a latch adapted to inhibit removal of the electronic card from the connector.

Multi-axis retention mechanism

A tailgate and hinge assembly for a pickup truck includes a pair of L-shaped hinge brackets secured to opposite sides of the truck body of the pickup truck. Each hinge bracket has an inverted U-shaped cam track therein for receiving the hinge cam pins on the tailgate. This hinge assembly allows the tailgate to be readily moved between a vertical closed position, a horizontal position and a depending vertical position. The novel hinge assembly enables the tailgate to be maintained in the open horizontal position without the need of chains or linkages.

Growing community of inventors

Portland, OR, United States of America

Daniel Willis