Universal Instruments Corporation

Daniel Whitney Ackerman

Koen Alexander Gieskes

A method and apparatus for automatically supplying surface mount chip components from a bulk feeder and placing the chip components on a substrate. The apparatus includes a base frame, a substrate feeding mechanism, a placement head, and a placement head positioning system. The substrate feeding mechanism delivers substrates to a component receiving position on the base frame. The placement head is translationally movable with respect to the base frame and includes a component supplying and placing mechanism, to supply components and place components on a substrate in a desired location. The component supplying and placing mechanism includes a component transfer mechanism, a component feeder, and a vacuum spindle. The transfer mechanism includes a rotatable wheel with a plurality of component holding compartments, a plurality of angularly disposed stations, and a drive mechanism for sequentially moving the compartments to at least a component receiving station and a component delivery station. The feeder receives a plurality of components from a container and feeds the components in a desired orientation to the receiving station of the transfer mechanism. The vacuum spindle is disposed above the delivery station of the transfer mechanism, and is vertically movable with respect to the delivery station for controlling and placing a component at the delivery station onto the substrate.

Method and apparatus for supplying and placing components

A female contact formed of a unitary piece of metal is provided. The contact includes an opposed pair of cantilevered contact blades so arranged as to preclude overstressing of the blades upon insertion or withdrawal of a mating male pin terminal.

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Binghamton, NY, United States of America

Daniel Whitney Ackerman