Molex Corporation

Daniel Wenzel

Hazelton P Avery

Scott D Sommers

Andrew Kolak

Pu Xie

Li Zhuang

Dominic Steier

Jerry Shubert

Chia Hung Mou

High-speed connectors and connector assemblies that include structures for alignment and/or improved thermal performance. In one example, a connector assembly, comprising: a housing comprising a port; a wafer assembly with contacts positioned in the port of the housing, the wafer assembly comprising a row of conductors, the row of conductors comprising a plurality of communication signal conductors and a plurality of ground conductors arranged in the row of conductors, wherein each communication signal conductor is positioned next to a ground conductor among the plurality of ground conductors in the row of conductors; and a ground path assembly comprising the plurality of ground conductors, a conductive ground shield, and a metal ground shield insert that is stitch mated with the conductive ground shield.

Shielded connector assemblies with temperature and alignment controls

Examples of connectors, connector assemblies, and wafer assemblies for improved shielding and thermal performance are described. In one example, a wafer assembly includes a ground path assembly and a row of conductors. The ground path assembly includes a first ground shield and a second ground shield. The row of conductors includes a plurality of communication signal conductors and a plurality of ground conductors arranged in the row of conductors. The first ground shield extends along a first pair of communication signal conductors among the plurality of communication signal conductors and the second ground shield extends along a second pair of the communication signal conductors among the plurality of communication signal conductors.

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Hoffman Estates, IL, United States of America

Daniel Wenzel