Sabic Global Technolgoies B.v.

Sabic Innovative Plastics IP B.v.

Daniel Sowle

Om Prakash

Ramasamy Anbarasu

Ashwit Dias

Anshuman Tripathi

Scott Michael Davis

Craig Lawrence Milne

Christopher Wall

Emile Homsi

Milind S Paradkar

Prakash Om

In an embodiment, an A-B-A structure, can comprise: a core layer comprising a first thermoplastic material having a first density (Y), wherein the core layer has a core thickness and wherein the core layer comprise at least one of (i) a through plane thermal conductivity of greater than equal to 0.1 W/m K, and (ii) a core layer density (X) that is X&#x2265;0.8Y; a first outer layer comprising a second thermoplastic material located on a first side of the core layer; and a second outer layer comprising the second thermoplastic material located on a second side of the core layer opposite the first side; wherein the core thickness is 30% to 75% of a total thickness of the A-B-A structure.

Thinwall composites for electronic enclosures and other devices

Various systems and methods for forming a polymer part with utilizing heating fluid are provided. In one embodiment of the present invention a method for forming polymer includes heating the mold apparatus with a first heat energy source comprising heating fluid to a first mold temperature, and then heating the mold apparatus with a second energy source which is different than the first energy source. The second energy source heats the mold surface to a second mold temperature greater than the first mold temperature to form the part to achieve a desired surface finish of the polymer part.

Method for forming a polymer part

Various mold apparatuses and methods for forming a polymer with induction heat energy are provided. In one embodiment of the present invention, a mold apparatus for forming polymer includes a mold having a top mold portion and a top mold surface that is magnetic. The bottom mold portion of the mold includes an induction heating unit that is at least partially embedded in the bottom mold portion that provides induction heat energy to the mold. The mold apparatus is constructed and arranged to dissipate greater than about 50% of the induction heat energy in the top mold portion. The induction heating unit of the bottom portion of the mold provides rapid heating to the top mold surface to provide high surface quality polymer parts and a shorter molding cycle time while utilizing less energy.

Mold apparatus for forming polymer and method

Growing community of inventors

Dalton, MA, United States of America

Daniel Sowle