Sinovia Technologies

Daniel Slotcavage

George Burkhard

A method of flash-curing a respective layer in an electronic device stack is provided. The method includes providing a stack of layers including a substrate and one or more electronically-active layers disposed on a surface of the substrate. The method further includes applying, over the stack of layers, a thermally-curable layer of material that includes a polymer or polymerizable material. The method further includes performing a non-equilibrium thermal process that includes raising a temperature of the thermally-curable layer of material, including the polymer or polymerizable material, above a first temperature for a length of time sufficient to cure the thermally-curable layer of material while maintaining the stack of layers below a second temperature that is less than the first temperature. The stack of layers is robust to temperatures below the second temperature.

Growing community of inventors

Menlo Park, CA, United States of America

Daniel Slotcavage