Delaware Capital Formation, Inc.

Rosemount Inc.

Daniel Scott Stevens

Jeffrey C Andle

Reichl B Haskell

Sabah Sabah

Dong-Pei Chen

Jeffrey Charles Andle

David J Lane

Thomas M Cunneen

Dana Y G Tucker

Jeffrey T Mink

Peter E Morley

A sensor module for monitoring an asset in an electrical power generation or distribution system includes a module body, a sensor, a sensor near field coupling structure, and an interrogation near field coupling structure. The sensor is supported by the module body, arranged to sense a parameter of the asset and configured to generate a sensor output relating to the parameter. The sensor near field coupling structure is connected to the sensor and supported on a first side of a module body. The interrogation near field coupling structure is supported on a second side of the module body. The sensor output is transmitted from the sensor near field coupling structure to the interrogation near field coupling structure. The sensor module is configured to provide electrical isolation between the asset and a monitoring circuit configured to receive the sensor output through the interrogation near field coupling structure.

Electric power generation or distribution asset monitoring

The current invention relates to a conductivity-dielectric (CD) electrode design with apertures that allow compressional waves to propagate away from the surface of the acoustic wave device unimpeded. This prevents reflection of compressional waves that would interact with the viscosity sensor surface, thus altering the device response. It allows compressional waves to pass through, and allows the dual mode viscosity sensor responses to be utilized for density/viscosity/elasticity measurement and correlation. The invention further offers methods of instrumentation to detect unwanted reflections, to compensate, and to correct for the distortions caused by reflections. Finally, the invention provides a system and method for utilizing deliberately introduced reflections to obtain additional information, including fluid density.

Controlled compressional wave components of thickness shear mode multi-measurand sensors

Circularly polarized resonant structures are obtained utilizing piezoelectric resonators made of materials and orientations selected in accordance with the teaching provided herewith. Further provided are radially polarized structures. Furthermore, the utilization of such resonators and structures as sensors, for frequency control application, for signal filtering, and the like, is also disclosed.

Lateral excitation of pure shear modes

An integrated package provides contactless communication through a coupling mechanism embedded in the package. Package types include Surface Mount Technology (SMT), Low Temperature Co-fired Ceramic (LTCC) technology, and dual-in-line integrated circuit pressed ceramic packages generally. The package can include an acoustic wave device (AWD) sensor such as a surface acoustic wave (SAW) device or a bulk acoustic wave (BAW) device. Coupling includes inductive and capacitive effects through plates, loops, spirals, and coils. Coil inductance and SAW capacitance can be parallel resonant at the desired SAW resonance with the coil impedance higher than the SAW impedance, minimizing load-pull effects.

Integrated coupling structures

Reflective and slanted array channelized sensor arrays having a broadband source providing acoustic energy to a reflective or slanted array that reflects a portion of the incident signal to one or more sensing films wherein the response is measured.

Reflective and slanted array channelized sensor arrays

Acoustic sensing utilizing a bridge structure coupled about a portion of at least two sides of said bridge to a base substrate, wherein said bridge includes a piezoelectric section and has at least one active acoustic region proximate said bridge. A sensing material is disposed on at least a portion of at least one surface of the bridge, wherein the bridge produces stress effects measurable by an acoustic wave device located in the active acoustic region. According to one embodiment, the stress effects are measured by an acoustic wave device to sense a target matter. As target molecules accumulate on a sensing film affixed to at least a portion of the bridge, stress is produced in the bridge inducing a frequency change measured by an acoustic wave device.

High sensitivity acoustic wave microsensors based on stress effects

An acoustic wave sensor employs an electromagnetic device (EMD) to transduce and amplify the response of an impedance element to a physical measurand. A measurand is defined as a physical parameter being quantified by measurement. One embodiment uses a magnetic field sensor employing a microelectromechanical system (MEMS) capacitor to affect a change in the response of a SAW filter.

Acoustic wave device physical parameter sensor

Acoustic sensing utilizing a cantilever structure coupled about at least one side of said cantilever to a base substrate, wherein said cantilever includes a piezoelectric section and has at least one acoustic wave device on a portion of the cantilever, wherein a flexure of the cantilever produces force-frequency effects measurable by the acoustic wave device. According to one embodiment, the cantilever sensor uses the flexure-frequency effect as measured by an acoustic wave device to sense a target matter. According to one embodiment, a sensing material is disposed on at least a portion of at least one surface of the cantilever.

High sensitivity microsensors based on flexure induced frequency effects

A package assembly for electronic components that allows for low-cost multiple cavities as well as a multiple compartment structure that allows more components in a smaller package size. In one embodiment the present invention is a multi-cavity package having at least one substrate forming at least one cavity with the substrate coupled to a shelf within the sidewalls of the package.

Multiple cavity/compartment package

The invention is a method and apparatus for improving the aging, pressure sensitivity, and acceleration sensitivity of crystal resonators. In one embodiment the invention includes a coplanar two-dimensional compliant mounting structure, wherein the symmetry and compliance of the planar mounting structure reduces the effects of residual static stresses and dynamic vibratory stresses on the vibration sensitivity performance of a crystal resonator. The structural elements include compliance loops that provide relief from the effects associated with manufacturing, thermal and vibration stresses.

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Stratham, NH, United States of America

Daniel Scott Stevens