Sony Deutschland Gmbh

Forschungszentrum Juelich Gmbh

Daniel Schwaab

Akio Yasuda

Jurina Wessels

Dirk Mayer

Andreas Offenhaeusser

Bjoern Luessem

Zoi Karipidou

Sandra Gilles

Gregor Kron

Akos Schreiber

Marc Riedel

A method of applying a pattern of metal, metal oxide, and/or semiconductor material on a substrate, a pattern created by that method, and uses of that pattern.

Method of applying a pattern of metal, metal oxide and/or semiconductor material on a substrate

A method of applying material on a substrate. The material to be applied can be a pattern of material.

Method of applying a material on a substrate

A method and associated substrate is provided for applying a layer or pattern of metal on a substrate. The method includes providing a target substrate, immobilizing a layer of polymeric material on the target substrate, and applying and immobilizing a layer or pattern of metal on the layer of polymeric material on the target substrate using a stamp onto which the layer or pattern of metal has previously been applied, by bringing the stamp into conformal contact with the target substrate.

Method of preparing a substrate having a layer or pattern of metal on it

The present invention relates to a method of patterning molecules on a substrate using a micro-contact printing process, to a substrate produced by said method and to uses of said substrate. It also relates to a device for performing the method according to the present invention.

Method of patterning molecules on a substrate using a micro-contact printing process

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Eitorf, Germany

Daniel Schwaab