Unaxis International Trading Ltd

Esec Ag

Daniel Schnetzler

Roland Stalder

Jonathan Medding

Martina Lustenberger

Marcel Niederhauser

Daniel Kloeckner

Ives Muehlemann

A die ejector comprises a chamber which can be subjected to vacuum and comprises a cover plate having a hole, a plurality of plates which are arranged in the interior of the chamber, protrude into the first hole and are jointly and also individually displaceable in a direction extending perpendicularly or in an oblique way in relation to the surface of the cover plate, and drive means in order to displace the plates. The drive means comprise a drive mechanism which comprises a motor and a pin which can be moved along a predetermined path and which is movable by the motor between two positions back and forth. Each of the plates comprises a path-like opening. The path-like opening is different from plate to plate in such a way that the plates are displaced in a predetermined sequence in the mentioned direction when the pin is moved along the path.

Die ejector

The detachment of a semiconductor chip () from a foil () and picking the semiconductor chip () from the foil () takes place with the support of a chip ejector (), that has a ramp (), the surface () of which is formed concave and ends at a stripping edge () projecting from the surface () of the chip ejector (), and a support area () with grooves () arranged next to the stripping edge (). Vacuum can be applied to the grooves (). The detachment and picking of the semiconductor chip () from the foil () takes place in that the wafer table () is shifted relative to the chip ejector () in order to pull the foil () over the stripping edge () protruding from the surface () of the chip ejector (), whereby the semiconductor chip () temporarily detaches itself at least partially from the foil () and lands on the foil () above the support area (), and in that the chip gripper () picks the semiconductor chip () presented on the support area ().

Method for detaching a semiconductor chip from a foil and device for mounting semiconductor chips

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Unteraegeri, Switzerland

Daniel Schnetzler